1SD110PJ1F43I1VG

The 1SD110PJ1F43I1VG is a Stratix® 10 DX Field Programmable Gate Array (FPGA) IC designed for high-density, memory-rich, and I/O-intensive designs. It combines a large count of logic elements and substantial on-chip RAM with a high-pin-count package and industrial operating range to address demanding embedded and industrial applications.

Key Features

• Core / Logic – Provides 1,325,000 logic elements to implement complex digital functions and wide parallelism in a single device.
• Memory – Includes 112,197,632 total RAM bits for on-chip buffering, caching, and memory-centric architectures.
• I/O – Supports 528 I/O pins to connect to multiple peripherals, high-speed interfaces, and system buses.
• Power – Operates from a supply range of 870 mV to 970 mV for core power domains.
• Package & Mounting – Supplied in a 1760-BBGA FCBGA package (supplier device package: 1760-FBGA, 42.5×42.5) and designed for surface-mount assembly.
• Temperature & Grade – Industrial grade device rated for operation from -40 °C to 100 °C.
• Compliance – RoHS compliant.

Typical Applications

• High-density digital processing – Leverages 1,325,000 logic elements to implement complex signal processing, protocol handling, and parallel compute tasks.
• Memory-intensive architectures – Uses 112,197,632 total RAM bits for large on-chip buffers, frame stores, and data-path acceleration without heavy external memory reliance.
• I/O-rich interfacing and aggregation – 528 I/O pins enable aggregation of multiple sensors, transceivers, or peripheral buses in a single FPGA solution.
• Industrial control and automation – Industrial-grade temperature range and surface-mount package support deployment in factory, instrumentation, and process-control environments.

Unique Advantages

• High logic capacity: 1,325,000 logic elements provide substantial implementation headroom for complex SoC-level functions on a single device.
• Large on-chip memory: 112,197,632 total RAM bits reduce dependence on external memory for latency-sensitive buffering and caching.
• Extensive connectivity: 528 I/O pins enable broad system integration and flexible interface routing.
• Compact, high-density package: 1760-BBGA FCBGA (1760-FBGA, 42.5×42.5) offers a high-pin-count solution in a compact footprint for space-constrained assemblies.
• Industrial readiness: Rated for -40 °C to 100 °C and supplied as an industrial-grade part for robust operation in demanding environments.
• Low-voltage core operation: Core supply range of 870 mV to 970 mV supports modern low-voltage system designs.

Why Choose 1SD110PJ1F43I1VG?

The 1SD110PJ1F43I1VG positions itself as a high-capacity FPGA for engineers building complex, memory-heavy, and I/O-dense systems that must meet industrial environmental requirements. Its combination of 1,325,000 logic elements, 112,197,632 RAM bits, and 528 I/O delivers integration and scalability for advanced embedded and industrial applications.

For designs that demand significant on-chip resources and a compact, surface-mount 1760-BBGA package rated from -40 °C to 100 °C, this Stratix® 10 DX device provides a platform-level solution aimed at reducing external BOM and consolidating system functions.

Request a quote or submit a quote to inquire about availability and pricing for 1SD110PJ1F43I1VG.