1SD110PJ2F43E1VG

The 1SD110PJ2F43E1VG is a Stratix® 10 DX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a high-density 1760-FBGA package. It provides a very large programmable logic capacity and substantial on-chip RAM to support complex hardware-accelerated functions.

Built for designs that require high logic element counts, large embedded memory, and significant I/O density, this extended-grade device supports surface-mount assembly and low-voltage core operation for modern system integration.

Key Features

• Core & Logic  1,325,000 logic elements enable implementation of complex custom logic, wide datapaths, and large parallel compute fabrics.
• On-chip Memory  112,197,632 total RAM bits provide extensive embedded memory for buffering, lookup tables, and state storage.
• I/O Density  528 I/O pins support high-bandwidth external interfaces and multi-channel connectivity.
• Power  Core supply range of 870 mV to 970 mV to match low-voltage system domains and help optimize power delivery.
• Package & Mounting  1760-FBGA supplier package (42.5 × 42.5 mm) / 1760-BBGA FCBGA footprint; surface-mount mounting type for standard PCB assembly.
• Operating Conditions & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C suitable for many commercial and industrial-adjacent environments.
• Regulatory  RoHS compliant for environmental conformity in lead-free production flows.

Typical Applications

• High-density compute acceleration  Large logic and memory capacity enable hardware acceleration for compute- and data-intensive algorithms.
• Network and packet processing  High I/O count and on-chip RAM support multi-channel networking interfaces and packet buffering.
• Advanced signal processing  Ample logic elements and embedded memory allow implementation of complex signal chains and DSP pipelines.

Unique Advantages

• Highly integrated logic capacity: The 1,325,000 logic elements reduce the need for multiple devices when implementing large-scale custom logic functions.
• Large embedded memory: 112,197,632 RAM bits provide extensive on-chip storage for low-latency buffering and state retention.
• Substantial I/O resources: 528 I/Os support dense external connectivity without external multiplexing or expansion.
• Compact high-density package: 1760-FBGA (42.5 × 42.5 mm) supports high pin-count routing in a single BGA footprint.
• Low-voltage core operation: 870 mV–970 mV supply range enables integration with modern low-voltage power architectures.
• Extended temperature grade: Rated for 0 °C to 100 °C operation to accommodate a broad set of deployment environments.

Why Choose 1SD110PJ2F43E1VG?

This Stratix® 10 DX FPGA part delivers a combination of very high logic capacity, substantial on-chip RAM, and a large I/O count in a single extended-grade FBGA package. It is positioned for designs that require consolidated programmable logic and memory resources to implement complex dataflow, acceleration, and multi-channel interface functions.

With RoHS compliance and a defined operating voltage and temperature window, the 1SD110PJ2F43E1VG offers predictable electrical and environmental parameters for integration into production systems where large-scale FPGA resources are needed.

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