1SD110PJ2F43I2VG

The 1SD110PJ2F43I2VG is an Intel Stratix® 10 DX Field Programmable Gate Array (FPGA) in a 1760-FBGA surface-mount package. It delivers very high logic capacity, substantial on-chip RAM, and a large number of I/Os for designs that require dense programmable logic and on-board memory.

Built and graded for industrial use, this device is targeted at systems that require consolidated logic, extensive buffering or data storage on chip, and robust thermal and voltage operating ranges.

Key Features

• Logic Capacity  1,325,000 logic elements provide high-density programmable fabric for large, complex designs.
• On-chip Memory  112,197,632 total RAM bits support extensive buffering, lookup tables, and on-chip data storage.
• I/O Count  528 general-purpose I/O pins enable broad external interfacing and parallel connectivity.
• Power  Core voltage supply range of 870 mV to 970 mV for the device core domain.
• Package & Mounting  1760-FBGA (42.5 × 42.5 mm) package case (1760-BBGA, FCBGA); designed for surface-mount PCB assembly.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant.
• Product Family Documentation  Intel provides a Stratix 10 DX device errata document that lists known device issues for the Stratix 10 DX production devices.

Typical Applications

• High-density programmable logic systems  Implement large-scale logic functions and complex state machines using the device’s 1,325,000 logic elements.
• Memory-intensive processing  Leverage 112,197,632 bits of on-chip RAM for buffering, packet handling, or local data stores.
• High-I/O interface platforms  Use 528 I/O pins for systems requiring many external connections or parallel sensor/actuator interfaces.
• Industrial control and automation  Operating range from −40 °C to 100 °C and industrial grade classification support deployment in factory and industrial applications.
• Compact board-level solutions  1760-FBGA packaging and surface-mount mounting enable dense PCB layouts for space-constrained designs.

Unique Advantages

• Highly integrated capacity: Combine 1,325,000 logic elements and 112,197,632 bits of RAM to reduce external components and simplify system architecture.
• Large I/O count: 528 I/O pins give designers flexibility to connect many peripherals or parallel data lanes without additional bridging logic.
• Industrial temperature range: Rated from −40 °C to 100 °C to meet thermal requirements of harsh operating environments.
• Compact high-pin-count package: 1760-FBGA (42.5 × 42.5 mm) balances pin density and PCB space for board-level integration.
• Controlled core power window: Specified 870 mV–970 mV core supply range supports predictable power-domain design and verification.
• RoHS compliant: Conforms to RoHS requirements for environmentally restricted materials.

Why Choose 1SD110PJ2F43I2VG?

The 1SD110PJ2F43I2VG combines very high logic density and substantial on-chip memory with a high I/O count and industrial-grade thermal specifications. It is positioned for engineers and teams building complex, memory-hungry, and I/O-intensive FPGA-based systems where consolidation of functions onto a single device reduces BOM and simplifies board design.

This part is suited to development and production designs that require scalable programmable logic capacity, predictable core-voltage bounds, and a surface-mount, high-pin-count package for compact, robust implementations. Intel’s published Stratix 10 DX documentation, including device errata for the series, is available to guide integration and qualification activities.

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