1SD21BPT1F53E2VG

IC FPGA STRATIX10DX 2597FBGA
Part Description

IC FPGA STRATIX10DX 2597FBGA

Quantity 1,309 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2597-FBGA (52.5x52.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2597-BBGA, FCBGANumber of I/O612Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells2073000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits99090432

Overview of 1SD21BPT1F53E2VG – FPGA with 2,073,000 logic elements

The 1SD21BPT1F53E2VG is a field-programmable gate array (FPGA) designed for high-density programmable logic applications. It provides 2,073,000 logic elements, 99,090,432 total RAM bits and 612 I/O pins in a 2597-FBGA (52.5×52.5 mm) surface-mount package, and is specified for extended-grade operation from 0°C to 100°C with a core voltage supply range of 770 mV to 970 mV.

Key Features

  • Core Logic
    2,073,000 logic elements suitable for large-scale, complex logic designs and dense programmable implementations.
  • Embedded Memory
    99,090,432 total RAM bits to support extensive on-chip buffering, lookup table storage and data processing needs.
  • I/O
    612 I/O pins to accommodate broad system connectivity and parallel interfacing requirements.
  • Power
    Core voltage supply range of 770 mV to 970 mV to match specified power rails and enable deterministic supply planning.
  • Package & Mounting
    2597-FBGA (52.5×52.5 mm) FCBGA package in a surface-mount form factor for board-level integration.
  • Temperature & Grade
    Extended grade device rated for 0°C to 100°C operating temperature range.
  • Environmental Compliance
    RoHS compliant.

Unique Advantages

  • High logic density: The 2,073,000 logic elements provide capacity for complex state machines, datapaths and deep combinational logic without immediate need for external programmable logic.
  • Substantial on-chip memory: With 99,090,432 RAM bits, the device supports large on-chip buffering, tables and frame storage to minimize external memory dependence.
  • Extensive I/O resources: 612 I/O pins enable wide bus interfaces, multiple peripheral connections and flexible routing for mixed-signal partitions.
  • Compact system footprint: The 2597-FBGA (52.5×52.5 mm) surface-mount package consolidates high integration into a single board-mountable component.
  • Design-in predictability: Defined supply range (770 mV–970 mV) and specified operating temperature (0°C–100°C) assist power and thermal planning for production designs.
  • Regulatory readiness: RoHS compliance supports environmental requirements for many commercial and industrial product lines.

Why Choose 1SD21BPT1F53E2VG?

The 1SD21BPT1F53E2VG is positioned for designs that require very large logic capacity, abundant on-chip memory and high I/O counts in a single, surface-mount FPGA package. Its extended-grade rating and defined supply and temperature envelopes make it suitable for robust commercial and industrial-class applications where these specific electrical and thermal parameters are required.

This device is appropriate for engineering teams seeking a highly integrated programmable logic solution with clear, verifiable specifications for logic density, memory capacity, I/O availability, package dimensions and supply/temperature requirements.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for the 1SD21BPT1F53E2VG. Our team will provide the details you need to evaluate this FPGA for your design.

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