1SD110PJ3F43I3VG

The 1SD110PJ3F43I3VG is an Intel Stratix® 10 DX field programmable gate array (FPGA) optimized for high-density programmable logic and large on‑chip memory. It combines a very large logic element count with extensive RAM and a high I/O count to support complex, integrated designs.

Specified as an industrial‑grade, surface‑mount device in a 1760‑BBGA (1760‑FBGA, 42.5 × 42.5 mm) package, this FPGA is characterized by a wide operating temperature range and a tightly defined core voltage range for stable operation in demanding environments.

Key Features

• High Logic Capacity  Provides 1,325,000 logic elements for implementing large-scale programmable logic designs and dense IP integration.
• Large On‑Chip Memory  Includes 112,197,632 total RAM bits to support buffering, packet processing, and memory-intensive algorithms directly on the device.
• Extensive I/O  Features 528 user I/O pins to interface with multiple high-speed peripherals, memory devices, and system-level interfaces.
• Power Supply  Core voltage supply defined from 870 mV to 970 mV to meet specified operating conditions.
• Industrial Grade  Rated for industrial applications with an operating temperature range of −40 °C to 100 °C.
• Package and Mounting  Packaged in a 1760‑BBGA, FCBGA format (supplier package: 1760‑FBGA, 42.5 × 42.5 mm) and intended for surface‑mount assembly.
• Regulatory  RoHS compliant, meeting common environmental and materials requirements.

Unique Advantages

• Very large programmable fabric  The 1,325,000 logic elements enable implementation of complex system functions and large IP cores without off‑chip partitioning.
• On‑chip memory to reduce system complexity  Over 112 million RAM bits help minimize external memory requirements and simplify board routing for memory‑centric designs.
• High I/O density  With 528 I/O pins, the device supports multiple external interfaces and parallel connections for flexible system integration.
• Industrial temperature range  Rated from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Robust packaging for high‑density boards  The 1760‑FBGA (42.5 × 42.5 mm) package provides a compact, high‑pin‑count solution suitable for dense PCB layouts.
• Defined core voltage window  Specified 870–970 mV core supply supports controlled power delivery and predictable device behavior.

Why Choose 1SD110PJ3F43I3VG?

The 1SD110PJ3F43I3VG positions itself as a high‑capacity, industrial‑grade Stratix® 10 DX FPGA suitable for designs that require large programmable logic resources, substantial on‑chip RAM, and a high number of I/O connections. Its defined electrical and thermal specifications make it a clear choice for applications that need predictable behavior across a wide temperature range.

For system designers and procurement teams targeting solutions with significant integration demands—where reducing external components and maximizing on‑chip resources matters—this FPGA delivers a combination of density, memory, and I/O in a proven BGA package and RoHS‑compliant construction.

Request a quote or contact sales to discuss availability, lead times, and volume pricing for the 1SD110PJ3F43I3VG.