1SD110PJ1F43I2VG

The 1SD110PJ1F43I2VG is an Intel Stratix® 10 DX field programmable gate array (FPGA) supplied in a 1760-BBGA FCBGA package. It delivers very high logic density and on-chip RAM in a surface-mount 1760-FBGA (42.5 × 42.5 mm) footprint, and is specified for industrial-grade temperature operation.

Targeted at designs that require large programmable logic capacity, substantial on-chip memory and significant I/O count, this device combines 1,325,000 logic element cells, 112,197,632 total RAM bits and 528 I/O pins with a core supply range of 870 mV to 970 mV.

Key Features

• Logic Capacity  1,325,000 logic element cells support large-scale designs and complex programmable logic implementations.
• On-Chip Memory  112,197,632 total RAM bits provide extensive embedded memory for buffering, lookup tables and state storage.
• I/O Density  528 I/O pins enable broad external connectivity for multi-channel interfaces and board-level integration.
• Package & Mounting  1760-BBGA (FCBGA) package; supplier device package listed as 1760-FBGA (42.5 × 42.5 mm). Surface-mount mounting type for standard PCB assembly processes.
• Power Supply  Core voltage supply range specified at 870 mV to 970 mV to match system power architecture requirements.
• Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory Status  RoHS compliant.
• Product Family Documentation  This device is part of the Intel Stratix 10 DX production family; the available device documentation includes device errata and family-level technical details.

Typical Applications

• Industrial Control Systems  Industrial-grade operating temperature and high logic density make the device suitable for programmable control, motion control and factory automation applications.
• High-Density FPGA Designs  Large logic element and on-chip RAM counts support compute- and memory-intensive FPGA functions where board-level integration of substantial programmable logic is required.
• Embedded Systems with Extensive I/O  With 528 I/O pins, the device is well suited to embedded systems that demand numerous external interfaces or channelized connectivity.

Unique Advantages

• Extensive Logic Resources: The 1,325,000 logic element capacity enables consolidation of large design functions into a single device, reducing system complexity.
• Large On-Chip Memory: 112,197,632 total RAM bits provide substantial embedded storage for buffering and stateful processing without immediate external memory dependency.
• High I/O Count: 528 I/O pins offer flexible board-level interfacing and support for multi-channel connectivity requirements.
• Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployment in industrial environments that require extended temperature tolerance.
• Compact High-Pin Package: 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) provides high pin count in a surface-mount form factor for space-constrained PCBs.
• Standards Compliance: RoHS compliance supports designs with environmental compliance requirements.

Why Choose 1SD110PJ1F43I2VG?

The 1SD110PJ1F43I2VG combines very large programmable logic capacity, substantial on-chip RAM and a high I/O count in a compact 1760-BBGA package, making it a suitable choice for industrial and high-density FPGA applications. Its specified core voltage range and industrial temperature rating allow integration into systems with defined power and environmental constraints.

Engineers and procurement teams seeking a Stratix 10 DX device with verified family documentation and device errata available in the technical literature will find this part appropriate for designs that require scale, integration and industrial operation.

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