10M50DCF484C8G

The 10M50DCF484C8G is an Intel MAX® 10 field-programmable gate array (FPGA) device supplied in a 484-BGA package. This commercial-grade FPGA provides 50,000 logic elements, 1,677,312 total RAM bits, and up to 360 general-purpose I/Os, with a supply voltage range of 1.15 V to 1.25 V and an operating temperature range of 0 °C to 85 °C.

Designed for applications that require significant on-chip logic capacity and memory, the device combines dense logic and RAM resources in a 484-FBGA (23×23) surface-mount package while meeting RoHS compliance.

Key Features

• Logic Capacity  Provides 50,000 logic elements to implement medium-to-large FPGA designs with substantial combinational and sequential resources.
• On-chip Memory  Includes 1,677,312 total RAM bits to support buffering, lookup tables, and embedded data storage directly on the FPGA fabric.
• I/O Density  Offers up to 360 I/Os for extensive external interfacing and connectivity options in I/O-intensive applications.
• Power and Supply  Operates from a core voltage supply range of 1.15 V to 1.25 V to match system power rails and design requirements.
• Package and Mounting  Supplied in a 484-BGA package (supplier device package: 484-FBGA 23×23) and intended for surface-mount assembly.
• Commercial Temperature Grade  Specified for operation from 0 °C to 85 °C to suit commercial-grade electronic systems.
• Environmental Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• I/O‑Intensive Control  Systems requiring large numbers of external signals can leverage the device’s 360 I/Os for interfacing with sensors, actuators, and peripherals.
• Embedded Logic and Glue  Use the 50,000 logic elements to implement custom control logic, glue logic, and protocol adaptation within embedded systems.
• On‑Chip Data Buffering  The 1,677,312 bits of RAM enable local buffering and data manipulation for real-time processing tasks.

Unique Advantages

• High Logic Density:  50,000 logic elements allow consolidation of multiple functions onto a single device, reducing board complexity.
• Substantial On‑Chip Memory:  Over 1.6 Mbits of RAM minimizes external memory requirements for many buffering and LUT applications.
• Large I/O Count:  360 I/Os support complex interfacing needs without additional I/O expanders, simplifying system design.
• Compact BGA Package:  484-FBGA (23×23) surface-mount package balances footprint and pin count for dense board layouts.
• Commercial Temperature Range:  Specified from 0 °C to 85 °C for reliable operation in standard commercial environments.
• Regulatory Compliance:  RoHS compliance supports environmentally conscious manufacturing processes.

Why Choose 10M50DCF484C8G?

The 10M50DCF484C8G positions itself as a capable commercial-grade MAX® 10 FPGA option where substantial logic, on-chip RAM, and high I/O count are required in a compact BGA package. Its combination of 50,000 logic elements, 1,677,312 bits of RAM, and 360 I/Os makes it suitable for embedded designs that need integrated logic and local memory while remaining within standard commercial temperature limits.

Engineers selecting this device benefit from a high-density FPGA platform that reduces external component count and simplifies board routing through a 484-FBGA (23×23) surface-mount package, all while maintaining RoHS compliance and operating within a defined supply voltage and temperature window.

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