1SG065HH3F35E2VG

IC FPGA STRATIX10GX 1152FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 392 51380224 612000 1152-BBGA, FCBGA

Quantity 139 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O392Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs76500Number of Logic Elements/Cells612000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51380224

Overview of 1SG065HH3F35E2VG – Stratix® 10 GX Field Programmable Gate Array, 1152-BBGA

The 1SG065HH3F35E2VG is a Stratix® 10 GX field programmable gate array (FPGA) IC delivering high on‑chip logic and memory capacity in a compact ball grid array package. It combines large logic element counts with substantial embedded RAM and a broad I/O complement to support complex programmable designs.

Designed for surface-mount assembly, this extended-grade device operates from a 770 mV to 970 mV power supply and across an operating temperature range of 0°C to 100°C. The device is RoHS compliant and supplied in a 1152‑BBGA (1152‑FBGA, 35×35) package.

Key Features

  • Logic Capacity — 612,000 logic elements for implementing large programmable logic functions and complex logic fabrics.
  • On‑chip Memory — 51,380,224 total RAM bits to support deep buffering, large lookup tables, and memory-intensive algorithms.
  • I/O — 392 I/O pins to accommodate extensive peripheral, sensor, and high‑pin‑count connectivity requirements.
  • Power Supply — Operates from 770 mV to 970 mV, enabling integration with low‑voltage power domains.
  • Package & Mounting — 1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA, 35×35) with surface-mount mounting for compact board layouts.
  • Operating Temperature — Rated for 0°C to 100°C operating temperature.
  • Grade & Compliance — Extended grade device, RoHS compliant.

Unique Advantages

  • Large programmable fabric: 612,000 logic elements provide headroom for complex control, data-path, and processing implementations without external programmable logic.
  • Significant on‑chip memory: Over 51 million RAM bits reduce dependence on external memory for high-throughput buffering and storage tasks.
  • Extensive connectivity: 392 I/O pins support multiple interfaces and dense system integration on a single device.
  • Compact surface‑mount package: 1152‑BBGA (35×35 supplier package) optimizes board space while supporting high pin counts for dense designs.
  • Extended grade and compliance: Extended grade device specification and RoHS compliance help meet regulatory and deployment requirements.

Why Choose 1SG065HH3F35E2VG?

The 1SG065HH3F35E2VG positions itself as a high‑capacity Stratix® 10 GX FPGA option for designs that require large programmable logic resources, substantial embedded RAM, and a broad I/O complement in a compact surface‑mount package. Its extended grade rating and RoHS compliance make it suitable for demanding commercial and embedded applications operating within the specified temperature and voltage ranges.

For engineering teams seeking scalability and integration, this device offers a balance of logic density, on‑chip memory, and I/O capability that supports consolidation of functions and can simplify board-level design choices while maintaining clear supplier support and documentation.

Request a quote or submit an inquiry to receive pricing and availability details for the 1SG065HH3F35E2VG. Our team can provide lead‑time and ordering information to support your design timelines.

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