1SG065HH3F35E2LG

The 1SG065HH3F35E2LG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) supplied in a 1152-BBGA FCBGA package. It provides large on-chip logic capacity and memory resources together with a high I/O count to support complex, board-level digital designs.

With 612,000 logic elements, 51,380,224 total RAM bits and 392 I/O pins, this device targets applications that require significant programmable logic, substantial on-chip memory, and extensive interfacing while operating from a nominal supply range of 820 mV to 880 mV.

Key Features

• Logic Capacity: 612,000 logic elements available for implementing complex custom logic, state machines, and datapaths.
• On-Chip Memory: 51,380,224 total RAM bits to support large buffering, lookup tables, and memory-intensive functions.
• I/O Resources: 392 I/O pins to accommodate wide bus interfaces, peripheral connections, and multi-channel signaling.
• Package & Mounting: 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Designed for surface-mount PCB assembly.
• Power Supply Range: Operates from 820 mV to 880 mV supply rails, enabling precise power planning at system level.
• Temperature Grade: Extended grade device rated for an operating range of 0 °C to 100 °C.
• Regulatory Compliance: RoHS compliant.

Typical Applications

• Logic- and Memory-Intensive FPGA Designs: Implement large custom logic networks and embedded memory structures using 612,000 logic elements and 51,380,224 bits of RAM.
• High I/O Count Systems: Deploy in systems requiring up to 392 programmable I/Os for broad signal routing and multi-interface connectivity.
• Surface-Mount Board Integration: Integrate into surface-mount PCB designs using the 1152-FBGA (35×35) package footprint.

Unique Advantages

• Substantial Logic Resources: 612,000 logic elements provide the capacity needed for complex, large-scale programmable designs.
• Large On-Chip Memory: Over 51 million RAM bits reduce reliance on external memory for buffering and data processing.
• Extensive I/O Count: 392 I/Os simplify board-level interfacing by supporting multiple parallel and serial connections directly.
• Compact FBGA Packaging: 1152-FBGA (35×35) package supports high-density board layouts while enabling surface-mount assembly.
• Extended Operating Grade: Rated for 0 °C to 100 °C operation to meet designs that require extended temperature capability.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose 1SG065HH3F35E2LG?

The 1SG065HH3F35E2LG delivers a combination of large logic capacity, significant embedded memory, and a high I/O count in a compact 1152-BBGA FCBGA package. Its extended operating grade and defined supply range make it suitable for designs that need predictable thermal and power planning.

This Intel-manufactured Stratix® 10 GX FPGA is appropriate for designers and engineering teams building solutions that require large programmable resources, substantial on-chip RAM, and flexible interfacing while maintaining a surface-mount, high-density board footprint.

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