1SG065HH3F35I1VG

The 1SG065HH3F35I1VG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1152-BBGA (FCBGA) package. It provides a combination of large logic capacity, substantial on-chip RAM, and a high I/O count targeted at industrial applications requiring broad temperature range and surface-mount packaging.

This device is positioned for designs that need significant programmable logic resources and embedded memory while operating within a supply range of 770 mV to 970 mV and an industrial temperature window of −40 °C to 100 °C.

Key Features

• Logic Capacity — 612,000 logic elements to support large-scale programmable logic designs.
• Embedded Memory — 51,380,224 total RAM bits for on-chip buffering, state storage, and data processing tasks.
• I/O Resources — 392 I/O pins to interface with a wide range of peripherals and external systems.
• Package and Mounting — 1152-BBGA (FCBGA) with supplier device package listed as 1152-FBGA (35×35); surface-mount for board-level assembly.
• Power — Device core supply range specified from 770 mV to 970 mV.
• Temperature and Grade — Industrial grade with operating temperature from −40 °C to 100 °C.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control Systems — Leverage the industrial temperature rating (−40 °C to 100 °C) and 392 I/O for robust sensor and actuator interfacing in factory and process automation.
• High-Density Logic Implementations — Use 612,000 logic elements and 51,380,224 RAM bits for complex programmable logic tasks and large finite-state designs.
• Board-Level Integration — The 1152-BBGA surface-mount package supports compact, high-density PCB layouts where a high I/O count and substantial on-chip resources are required.

Unique Advantages

• Substantial Logic Resources: 612,000 logic elements provide capacity for sophisticated, large-scale logic implementations without external logic expansion.
• Large On-Chip RAM: Over 51 million RAM bits enable extensive on-chip buffering and state retention, reducing the need for external memory in many designs.
• High I/O Count: 392 I/O pins support broad peripheral connectivity and flexible board-level partitioning.
• Industrial Rated: −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
• Compact FCBGA Packaging: 1152-BBGA (35×35 supplier package) balances pin density and PCB footprint for space-constrained applications.
• RoHS Compliant: Meets RoHS environmental requirements for lead-free assembly and regulatory compliance.

Why Choose 1SG065HH3F35I1VG?

The 1SG065HH3F35I1VG offers a balance of large programmable logic capacity, extensive on-chip RAM, and a high number of I/O in a compact 1152-BBGA surface-mount package. Its industrial-grade temperature range and specified core voltage window make it suitable for designs that require both substantial integration and environmental resilience.

This FPGA is well suited for engineering teams developing complex logic and memory-intensive applications that need many external interfaces while maintaining a compact board footprint and compliance with RoHS requirements.

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