1SG085HN1F43E1VG

The 1SG085HN1F43E1VG is an Intel Stratix® 10 GX Field Programmable Gate Array supplied in a 1760-BBGA FCBGA package. It delivers high logic capacity and large on-chip RAM in a surface-mount BGA footprint, targeting high-performance, computation- and I/O-intensive FPGA designs.

Built on the Stratix 10 GX device family platform, the part benefits from family-level innovations such as the Intel Hyperflex core architecture and modern process technology noted in the device overview, making it suitable for demanding applications that require dense logic, substantial embedded memory, and extensive I/O.

Key Features

• Logic Capacity — 850,000 logic elements provide the resources required for complex, high-density digital designs.
• On-chip Memory — 71,303,168 total RAM bits of embedded memory support large buffering, lookup tables, and local storage for compute-intensive functions.
• I/O Density — 688 I/O pins give broad external connectivity for high-bandwidth interfaces and multi-channel systems.
• Package and Mounting — 1760-BBGA (FCBGA) surface-mount package; supplier device package listed as 1760-FBGA (42.5 × 42.5 mm) for compact module integration.
• Power Supply — Core voltage supply range from 770 mV to 970 mV, enabling operation within specified low-voltage core rails.
• Operating Environment — Extended grade with an operating temperature range of 0 °C to 100 °C.
• Compliance — RoHS compliant.
• Family-Level Innovations — As part of the Intel Stratix 10 GX family, the device is associated with features documented in the device overview such as the Intel Hyperflex core architecture and 14 nm tri-gate technology.

Typical Applications

• High-performance networking — Use the device where dense logic and large on-chip RAM are needed for packet processing, switch or router functions, and high-bandwidth data paths.
• Data center acceleration — Deploy in hardware acceleration roles that require significant logic resources and embedded memory for buffering and computation.
• Telecommunications equipment — Suitable for baseband processing, protocol offload, and multi-channel I/O aggregation where many external interfaces are required.
• High-density embedded systems — Integrate into systems that demand a compact BGA package with extensive I/O and substantial local RAM.

Unique Advantages

• High logic capacity: 850,000 logic elements allow implementation of large, partitioned designs without immediately moving to multi-device solutions.
• Significant on-chip memory: Over 71 million bits of RAM reduces external memory dependence for many buffering and storage tasks, simplifying board-level design.
• Extensive interface capability: 688 I/O supports multiple high-bandwidth channels and mixed-signal interfacing, enabling flexible system partitioning.
• Compact, manufacturable package: 1760-BBGA (42.5 × 42.5 mm) provides a dense mounting solution suitable for space-constrained PCBs while retaining large I/O counts.
• Low-voltage core operation: 770–970 mV core supply supports integration into designs with modern power-rail architectures.
• Extended temperature grade: Rated 0 °C to 100 °C to support deployment in temperature-controlled and commercial-grade environments requiring broader ranges than standard room-temperature parts.

Why Choose 1SG085HN1F43E1VG?

The 1SG085HN1F43E1VG combines a high logic element count, substantial embedded RAM, and a large I/O complement in a single 1760-BBGA package, making it well suited for advanced FPGA solutions that demand dense implementation and broad external connectivity. As a member of the Stratix 10 GX family, it benefits from the device-level architecture and process attributes documented in the family overview.

This part is ideal for engineering teams building high-throughput networking, compute acceleration, and telecommunications equipment where on-chip resources, I/O flexibility, and a compact form factor provide long-term design scalability and integration advantages.

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