1SG211HN3F43I1VG

The 1SG211HN3F43I1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) offered in a 1760‑BBGA FCBGA package. It is built on the Stratix 10 family architecture, featuring the Intel Hyperflex core architecture and high‑performance transceiver and hard IP capabilities for demanding bandwidth and processing applications.

With 2,110,000 logic elements, 140,509,184 bits of on‑chip RAM and 688 I/O pins, this device targets advanced communications, networking and high‑performance compute designs that require dense logic, large embedded memory and extensive I/O connectivity within an industrial temperature grade.

Key Features

• Core Architecture  Based on the Intel Hyperflex core architecture as described for the Stratix 10 family, delivering significantly increased core performance compared to previous generation high‑performance FPGAs.
• Logic Capacity  2,110,000 logic elements for implementing large, complex digital designs and system‑level integration.
• Embedded Memory  140,509,184 total RAM bits of on‑chip memory to support large buffers, lookup tables and on‑chip data storage.
• I/O and Transceivers  688 I/O pins in a 1760‑BBGA package; the Stratix 10 GX family includes high‑speed transceiver capabilities suitable for high‑bandwidth serial links.
• Power Supply Range  Core voltage supply range of 770 mV to 970 mV to support defined power and performance operating points.
• Package and Mounting  1760‑BBGA (FCBGA) surface mount package, supplier package 1760‑FBGA with a 42.5 mm × 42.5 mm footprint for dense board integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Compliance  RoHS compliant.

Typical Applications

• High‑performance Networking and Telecom  Implements wide bandwidth packet processing, line cards and backplane interfaces using the device’s high logic count and extensive I/O.
• Data Center and Accelerators  Supports compute acceleration and large on‑chip buffers for algorithmic workloads requiring dense logic and embedded memory.
• High‑speed Serial Communications  Enables multi‑Gbps serial links and protocol offload using the Stratix 10 GX family’s transceiver and hard IP features.
• Signal Processing and DSP  Large logic and memory resources allow implementation of complex DSP chains and dataflow designs.

Unique Advantages

• High Logic Density: 2,110,000 logic elements provide the capacity to consolidate multiple functions and reduce external glue logic.
• Substantial On‑Chip Memory: 140,509,184 bits of RAM reduce dependence on external memory for many buffering and lookup requirements.
• Extensive I/O Count: 688 I/O pins in a compact 1760‑BBGA package simplify board design for complex interfacing needs.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in industrial environments.
• Optimized Power Window: 770 mV to 970 mV core supply range enables designers to target appropriate power/performance tradeoffs.
• RoHS Compliant: Meets regional material compliance requirements for lead‑free assembly.

Why Choose 1SG211HN3F43I1VG?

The 1SG211HN3F43I1VG delivers a combination of large logic and memory capacity, extensive I/O, and an industrial temperature rating—making it well suited for advanced communications, networking and compute acceleration applications that require scalable FPGA resources. Its placement within the Stratix 10 GX family brings family‑level innovations such as the Intel Hyperflex core architecture and high‑speed transceiver capabilities to demanding designs.

Choose this device when you need high integration density, substantial on‑chip RAM and a high I/O count in a 1760‑BBGA footprint for industrial deployments where robustness and performance are essential.

Request a quote or submit a pricing and availability inquiry to evaluate 1SG211HN3F43I1VG for your next high‑performance FPGA design.