1SG211HN3F43I2VG

The 1SG211HN3F43I2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA FCBGA package, targeted at demanding, high-performance applications. Built on the Stratix 10 family innovations and Intel Hyperflex™ core architecture, this device offers a high logic capacity and large on-chip RAM to support complex, bandwidth- and compute-intensive designs.

With an industrial operating temperature range and a low-voltage core supply window, the device is suited for systems that require broad I/O counts, large internal memory, and robust performance in challenging environments.

Key Features

• Core Architecture  Intel Hyperflex™ core architecture (Stratix® 10 GX family) designed for high-performance programmable logic.
• Logic Capacity  2,110,000 logic elements to implement large-scale logic and control functions.
• On‑Chip Memory  140,509,184 total RAM bits for buffering, packet processing, and large local data storage.
• I/O Density  688 I/O pins to support extensive external interfaces and parallel connectivity.
• Power Supply  Core voltage supply range from 770 mV to 970 mV for the device core.
• Package & Mounting  1760-BBGA (FCBGA) package; supplier device package listed as 1760-FBGA (42.5×42.5); surface-mount device.
• Temperature & Grade  Industrial-grade device with an operating temperature range of –40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-performance networking  Large logic capacity and high I/O count enable packet processing, custom switching, and line-rate interface implementations.
• Data center acceleration  On-chip RAM and extensive logic resources support hardware acceleration for compute and data-path offload.
• Telecommunications equipment  Industrial temperature rating and dense I/O make the device suitable for infrastructure components requiring extended operating ranges.
• Advanced signal processing  Significant internal memory and logic resources support complex DSP pipelines and buffer-intensive algorithms.

Unique Advantages

• High logic density: 2,110,000 logic elements provide the capacity to implement large, integrated systems on a single FPGA.
• Substantial on-chip RAM: 140,509,184 total RAM bits reduce dependence on external memory for many buffering and real‑time processing tasks.
• Extensive I/O capability: 688 I/O pins enable broad peripheral and high‑bandwidth interface support without extensive external multiplexing.
• Industrial robustness: Rated for –40 °C to 100 °C operation, enabling deployment in environments with wide temperature swings.
• Compact system-level package: 1760-BBGA FCBGA (42.5×42.5) provides a high-density footprint for space-constrained boards with surface-mount assembly.
• Regulatory alignment: RoHS compliance supports environmentally regulated product programs.

Why Choose 1SG211HN3F43I2VG?

The 1SG211HN3F43I2VG delivers a combination of high logic capacity, large on‑chip RAM, and dense I/O in an industrial-grade Stratix® 10 GX FPGA package. It is positioned for engineers and system designers building high-throughput, compute-intensive, or environmentally demanding systems that benefit from on‑device integration of logic and memory.

Designed around Intel's Stratix 10 family innovations, this device provides a scalable platform for complex digital designs where long-term robustness, performance, and a broad feature set are required.

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