1SG211HN3F43I2LG

The 1SG211HN3F43I2LG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760‑BBGA FCBGA package. It is built on the Stratix 10 device family architecture and leverages the family’s Intel Hyperflex core and 14 nm tri‑gate process innovations to address advanced, bandwidth- and compute‑intensive system designs.

Targeted at industrial applications, this device combines high logic capacity, substantial on‑chip RAM, and a large I/O count to support demanding networking, compute acceleration, and high‑speed signal processing tasks while operating over an extended temperature range.

Key Features

• Core Architecture  Intel Hyperflex core architecture and 14 nm tri‑gate (FinFET) technology as described for the Stratix 10 family, delivering higher core performance and improved power efficiency versus previous generations.
• Logic Capacity  2,110,000 logic elements, providing a substantial fabric for large, complex designs.
• Logic Array Structure  263,750 LABs/CLBs to structure and partition logic for scalable design implementation.
• On‑Chip Memory  140,509,184 total RAM bits for large buffering, lookup tables, and state storage requirements.
• I/O  688 device I/Os to support wide parallel interfaces and connectivity to external peripherals and subsystems.
• High‑Speed Transceiver and Protocol Support (Family)  Stratix 10 family innovations include heterogeneous 3D SiP transceiver tiles and transceiver data rates (family level) suitable for high‑bandwidth serial links and protocol IP such as PCI Express and 10G Ethernet as described in the device overview.
• Power and Core Voltage  Core voltage supply range of 820 mV to 880 mV to match system power architectures and enable precise power sequencing.
• Package and Mounting  1760‑BBGA FCBGA package (supplier device package: 1760‑FBGA, 42.5 × 42.5 mm) for surface mount assembly.
• Operating Range  Industrial grade with an operating temperature range of −40 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• High‑Performance Networking  Implements packet processing, switching/bridging, and high‑speed interface logic where large logic capacity, abundant I/O, and family transceiver capabilities are required.
• Data Center Acceleration  Accelerates compute tasks and custom offload functions using the device’s substantial logic and on‑chip RAM resources.
• Telecommunications and Backplane Interfaces  Supports protocol IP and high‑speed serial connectivity provided by Stratix 10 family transceiver technologies for backplane and line card designs.
• Advanced Signal Processing  Deploys variable precision DSP algorithms and large memory buffers for real‑time signal conditioning and analytics.

Unique Advantages

• High Logic Density: 2,110,000 logic elements enable complex system functions and large integration of custom logic without external ASIC dependencies.
• Substantial On‑Chip RAM: 140,509,184 RAM bits reduce external memory dependence for buffering and on‑device data manipulation.
• Extensive I/O Count: 688 I/Os provide flexibility for wide parallel interfaces, multi‑lane buses, and mixed signal partitioning.
• Industrial Operating Range: Rated from −40 °C to 100 °C for reliable operation in demanding environments.
• Compact, High‑Pin‑Count Package: 1760‑FBGA package (42.5 × 42.5 mm) consolidates high pin count and thermal considerations into a manageable footprint.
• Tightly Controlled Core Voltage: 820–880 mV supply range supports predictable power design and sequencing.

Why Choose 1SG211HN3F43I2LG?

This Stratix 10 GX device positions itself for designs that require significant on‑chip resources, robust I/O, and industrial temperature operation. With a combination of 2.11 million logic elements, over 140 million bits of RAM, and the Stratix 10 family’s architectural innovations, it addresses high‑bandwidth, compute‑intensive applications where integration and thermal‑conscious packaging matter.

Engineers and system designers selecting 1SG211HN3F43I2LG gain a scalable FPGA platform from the Stratix 10 family that supports complex logic implementation and large memory footprints while meeting industrial environmental and supply‑voltage constraints.

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