1SG211HN3F43I3XG

The 1SG211HN3F43I3XG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760‑BBGA FCBGA package, designed for high-density, industrial-grade applications. It combines a large logic fabric with extensive on‑chip memory and I/O to support high-performance signal processing, system integration, and high‑speed communications.

As a member of the Stratix 10 GX family, the device benefits from the family’s core innovations—including the Intel Hyperflex core architecture and advanced 14 nm tri‑gate process—delivering increased core performance and improved power efficiency for demanding system designs.

Key Features

• High Logic Density — 2,110,000 logic elements to implement complex custom logic, control planes, and pipeline architectures.
• On‑Chip Memory — 140,509,184 total RAM bits for large buffering, lookup tables, and memory‑intensive algorithms.
• Extensive I/O — 688 I/O pins to support broad external interfacing and multi‑lane connectivity.
• Package & Mounting — 1760‑BBGA (supplier device package: 1760‑FBGA, 42.5 × 42.5 mm) in a surface‑mount form factor for compact, board‑level integration.
• Industrial Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Power Supply — Core voltage specified from 820 mV to 880 mV for predictable power planning and supply design.
• Standards & Compliance — RoHS compliant for regulatory alignment in lead‑free manufacturing.
• Stratix 10 Family Innovations — Family-level features include the Intel Hyperflex core architecture, 14 nm tri‑gate (FinFET) process, heterogeneous 3D SiP transceiver tiles, and hard IP such as PCI Express and 10G Ethernet (as described in Stratix 10 GX series documentation).

Typical Applications

• High‑speed communications — FPGA fabric and family transceiver/PHY innovations support backplane and line‑rate designs requiring multi‑lane serial connectivity and packet processing.
• Compute and DSP acceleration — Large logic capacity and significant on‑chip RAM enable offload of compute‑intensive and low‑latency signal processing tasks.
• Memory‑centric systems — High internal RAM bit count supports buffering, caching, and complex memory architectures for data‑intensive applications.
• Industrial control and automation — Industrial temperature rating and surface‑mount package accommodate rugged, board‑level deployments in factory and process control equipment.

Unique Advantages

• Substantial logic resources: 2,110,000 logic elements provide headroom for large designs, reducing partitioning and offload effort.
• Large on‑chip memory: Over 140 million RAM bits simplify buffering and algorithm implementation without immediate dependence on external memory.
• Broad I/O count: 688 I/Os enable complex peripheral interfacing, multi‑lane SerDes arrangements, and flexible board routing options.
• Industrial temperature range: Operation from −40 °C to 100 °C supports deployment in demanding thermal environments.
• Compact, manufacturable package: 1760‑FBGA (42.5 × 42.5 mm) surface‑mount package balances density with assembly compatibility.
• Family heritage and architectural advances: Benefits from Stratix 10 GX family innovations such as Hyperflex core architecture and advanced process technology for improved performance and efficiency.

Why Choose 1SG211HN3F43I3XG?

The 1SG211HN3F43I3XG targets engineers and system designers who require a high‑density, industrial‑grade FPGA with ample on‑chip memory and I/O for complex, high‑performance applications. Its combination of 2,110,000 logic elements, 140,509,184 RAM bits, and 688 I/Os makes it well suited for demanding compute, signal processing, and high‑bandwidth interface tasks while meeting industrial thermal and manufacturing requirements.

As part of the Intel Stratix 10 GX family, this device integrates family‑level architectural enhancements that support scalable designs and long‑term platform value through a well‑documented ecosystem and device documentation.

Request a quote or submit a product inquiry to evaluate 1SG211HN3F43I3XG for your next high‑performance FPGA design.