1SG250HH1F55E2LG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 1160 2500000 2912-BBGA, FCBGA |
|---|---|
| Quantity | 734 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2912-FBGA, FC (55x55) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2912-BBGA, FCBGA | Number of I/O | 1160 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 312500 | Number of Logic Elements/Cells | 2500000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 204472320 |
Overview of 1SG250HH1F55E2LG – Stratix® 10 GX FPGA, 2,500,000 logic elements, 1160 I/Os, 2912-BBGA
The 1SG250HH1F55E2LG is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 2912-BBGA (FCBGA) package for surface mount applications. It integrates a large programmable fabric with 2,500,000 logic elements and substantial on-chip memory to address high-performance, high-bandwidth system designs.
Built on the Stratix 10 family architecture, this device is suited for applications that require dense logic capacity, high I/O count, advanced transceiver capability, and low-voltage core operation, while operating across an extended temperature range.
Key Features
- Programmable Fabric 2,500,000 logic elements provide dense logic capacity for complex FPGA designs and large-scale integration.
- On-chip Memory Total RAM capacity of 204,472,320 bits supports large buffering, packet processing, and dataflow operations within the FPGA fabric.
- I/O Density 1160 I/Os enable high channel counts and broad external interfacing for multi-lane communications and system integration.
- Advanced Architecture (Family) Part of the Stratix 10 GX family featuring the Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) technology as described in the device overview.
- High-speed Transceiver and IP (Family) Stratix 10 family details include heterogeneous 3D SiP transceiver tiles, high-speed transceivers, and hard IP blocks for common protocols as documented in the device overview.
- DSP and Compute (Family) Family-level variable precision DSP blocks and hard floating-point capabilities are part of the Stratix 10 feature set referenced in the overview.
- Package and Mounting 2912-BBGA (FCBGA) package; supplier device package listed as 2912-FBGA, FC (55×55). Surface mount mounting type.
- Power and Supply Specified core supply voltage range: 820 mV to 880 mV.
- Temperature Grade Extended-grade operating temperature range: 0 °C to 100 °C.
- Compliance RoHS compliant.
Typical Applications
- High-performance networking and switching Use the high logic capacity and large on-chip RAM for packet processing, protocol offload, and multi-lane network interface implementations.
- Data center acceleration Leverage the dense fabric and DSP resources for acceleration tasks such as compression, encryption offload, and custom compute kernels.
- High-speed communications The device’s family transceiver and I/O density support backplane and chip-to-chip interfaces requiring many lanes and high throughput.
- Advanced signal processing Large logic and memory resources enable complex signal chain implementations, filtering, and multi-channel data acquisition processing.
Unique Advantages
- Massive logic capacity: 2,500,000 logic elements for highly integrated designs and consolidation of multiple functions into a single device.
- Extensive on-chip RAM: 204,472,320 total RAM bits to minimize external memory dependence and reduce system latency.
- High I/O count: 1160 I/Os for broad connectivity and support of multi-lane interfaces without complex external multiplexing.
- Optimized core power window: Core voltage specified at 820–880 mV enabling designed power delivery and thermal planning.
- Production-ready packaging: 2912-BBGA FCBGA package and surface-mount mounting streamline PCB assembly for high-density boards.
- Extended operating range: 0 °C to 100 °C rating suitable for many commercial and enterprise deployment environments.
Why Choose 1SG250HH1F55E2LG?
The 1SG250HH1F55E2LG positions itself for demanding, logic- and memory-intensive applications that require high I/O density and advanced Stratix 10 family architecture capabilities. With 2.5 million logic elements, substantial on-chip RAM, and a high pin-count FCBGA package, this FPGA is intended for designers consolidating complex system functions into a single programmable device.
Choosing this Stratix 10 GX device provides a path to scalable, high-throughput implementations while leveraging the documented family features such as the Hyperflex core architecture, advanced transceiver options, and DSP resources described in the device overview.
Request a quote or submit an inquiry to receive pricing, availability, and technical support information for 1SG250HH1F55E2LG. Provide your project requirements to get a tailored response for procurement and deployment planning.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018