1SG250HH1F55E2LG

IC FPGA 1160 I/O 2912BGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 1160 2500000 2912-BBGA, FCBGA

Quantity 734 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2912-FBGA, FC (55x55)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2912-BBGA, FCBGANumber of I/O1160Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs312500Number of Logic Elements/Cells2500000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits204472320

Overview of 1SG250HH1F55E2LG – Stratix® 10 GX FPGA, 2,500,000 logic elements, 1160 I/Os, 2912-BBGA

The 1SG250HH1F55E2LG is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 2912-BBGA (FCBGA) package for surface mount applications. It integrates a large programmable fabric with 2,500,000 logic elements and substantial on-chip memory to address high-performance, high-bandwidth system designs.

Built on the Stratix 10 family architecture, this device is suited for applications that require dense logic capacity, high I/O count, advanced transceiver capability, and low-voltage core operation, while operating across an extended temperature range.

Key Features

  • Programmable Fabric  2,500,000 logic elements provide dense logic capacity for complex FPGA designs and large-scale integration.
  • On-chip Memory  Total RAM capacity of 204,472,320 bits supports large buffering, packet processing, and dataflow operations within the FPGA fabric.
  • I/O Density  1160 I/Os enable high channel counts and broad external interfacing for multi-lane communications and system integration.
  • Advanced Architecture (Family)  Part of the Stratix 10 GX family featuring the Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) technology as described in the device overview.
  • High-speed Transceiver and IP (Family)  Stratix 10 family details include heterogeneous 3D SiP transceiver tiles, high-speed transceivers, and hard IP blocks for common protocols as documented in the device overview.
  • DSP and Compute (Family)  Family-level variable precision DSP blocks and hard floating-point capabilities are part of the Stratix 10 feature set referenced in the overview.
  • Package and Mounting  2912-BBGA (FCBGA) package; supplier device package listed as 2912-FBGA, FC (55×55). Surface mount mounting type.
  • Power and Supply  Specified core supply voltage range: 820 mV to 880 mV.
  • Temperature Grade  Extended-grade operating temperature range: 0 °C to 100 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • High-performance networking and switching  Use the high logic capacity and large on-chip RAM for packet processing, protocol offload, and multi-lane network interface implementations.
  • Data center acceleration  Leverage the dense fabric and DSP resources for acceleration tasks such as compression, encryption offload, and custom compute kernels.
  • High-speed communications  The device’s family transceiver and I/O density support backplane and chip-to-chip interfaces requiring many lanes and high throughput.
  • Advanced signal processing  Large logic and memory resources enable complex signal chain implementations, filtering, and multi-channel data acquisition processing.

Unique Advantages

  • Massive logic capacity: 2,500,000 logic elements for highly integrated designs and consolidation of multiple functions into a single device.
  • Extensive on-chip RAM: 204,472,320 total RAM bits to minimize external memory dependence and reduce system latency.
  • High I/O count: 1160 I/Os for broad connectivity and support of multi-lane interfaces without complex external multiplexing.
  • Optimized core power window: Core voltage specified at 820–880 mV enabling designed power delivery and thermal planning.
  • Production-ready packaging: 2912-BBGA FCBGA package and surface-mount mounting streamline PCB assembly for high-density boards.
  • Extended operating range: 0 °C to 100 °C rating suitable for many commercial and enterprise deployment environments.

Why Choose 1SG250HH1F55E2LG?

The 1SG250HH1F55E2LG positions itself for demanding, logic- and memory-intensive applications that require high I/O density and advanced Stratix 10 family architecture capabilities. With 2.5 million logic elements, substantial on-chip RAM, and a high pin-count FCBGA package, this FPGA is intended for designers consolidating complex system functions into a single programmable device.

Choosing this Stratix 10 GX device provides a path to scalable, high-throughput implementations while leveraging the documented family features such as the Hyperflex core architecture, advanced transceiver options, and DSP resources described in the device overview.

Request a quote or submit an inquiry to receive pricing, availability, and technical support information for 1SG250HH1F55E2LG. Provide your project requirements to get a tailored response for procurement and deployment planning.

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