1SG250HH2F55I1VG

The 1SG250HH2F55I1VG is an Intel Stratix® 10 GX FPGA in a 2912-BBGA (FCBGA) package designed for high-capacity, high-throughput programmable logic implementations. Built on the Stratix 10 GX family architecture, it targets demanding applications that require large logic density, extensive on-chip memory, and broad I/O connectivity while supporting industrial temperature operation.

As part of the Stratix 10 GX family, this device benefits from family-level innovations such as the Intel Hyperflex™ core architecture and advanced 14 nm process technologies to deliver the performance and integration expected in advanced networking, compute acceleration, and data-processing designs.

Key Features

• High Logic Capacity — 2,500,000 logic elements (logic cells) to implement complex, large-scale digital designs.
• Large On-Chip Memory — 204,472,320 total RAM bits for buffering, large lookup tables, and packet/stream processing tasks.
• Extensive I/O — 1,160 device I/Os to support dense external connectivity and multiple parallel interfaces.
• Family-Level Architecture — Incorporates Stratix 10 GX family innovations such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate technology (family-level specification).
• High-Speed Transceiver and IP Ecosystem (Family) — Stratix 10 GX family documentation includes support for high-speed transceivers, hardened PCI Express and memory controller IP (family-level capabilities described in the device overview).
• Power Supply Range — Core voltage supply specified from 770 mV to 970 mV to support optimized power/ performance operating points.
• Industrial Temperature Grade — Specified operating temperature from −40 °C to 100 °C for robust operation in industrial environments.
• Package and Mounting — Supplied in a 2912-BBGA FCBGA (55 × 55) package; surface-mount device suitable for modern PCB assembly processes.
• Standards Compliance — RoHS compliant.

Typical Applications

• High‑performance Networking and Telecom — Leverage the device’s large logic and memory resources along with family transceiver/IP capabilities for packet processing, routing, and line-rate protocol acceleration.
• Data Center Acceleration — Implement compute offload, streaming analytics, and hardware accelerators that require high logic density and substantial on-chip RAM.
• High‑Speed Test & Measurement — Use the wide I/O count and large memory for data capture, preprocessing, and real-time analysis in test instrumentation.
• Embedded Signal Processing — Deploy variable‑precision DSP and on-chip memory (family-level DSP capabilities described in the device overview) for high-throughput signal and image processing pipelines.

Unique Advantages

• Scalable Logic Footprint: 2.5 million logic elements provide the capacity to implement complex systems on a single device, reducing BOM and board-level component count.
• Substantial On-Chip Memory: Over 204 million bits of RAM enable large buffers, stateful processing, and reduced external memory dependence for many workloads.
• High I/O Density: 1,160 I/Os support multiple parallel interfaces and high pin-count system designs without extensive external multiplexing.
• Industrial Temperature Range: −40 °C to 100 °C operation allows deployment in harsh or temperature-variable installations common to industrial and communications equipment.
• Family-Level Performance Innovations: Benefit from Stratix 10 GX family features such as the Hyperflex core architecture and 14 nm process technology for improved core performance and power efficiency (as described in the device family overview).
• Packaging for Dense Boards: 2912-BBGA (FCBGA) 55 × 55 package offers high ball-count integration for compact, high-density PCB layouts.

Why Choose 1SG250HH2F55I1VG?

The 1SG250HH2F55I1VG places substantial programmable resources—2.5 million logic elements and more than 204 million RAM bits—into a single industrial-grade FCBGA package with 1,160 I/Os, enabling consolidation of complex functions and high-bandwidth interfaces on one device. As a member of the Intel Stratix 10 GX family, it is specified alongside family-level innovations including the Hyperflex core architecture and advanced silicon process attributes that support high-performance, power-conscious implementations.

This device is well suited for designers building high-throughput networking, compute acceleration, and advanced signal processing systems that require large on-chip resources, robust I/O, and industrial temperature operation. Its combination of capacity, memory, and package density offers a long-term, scalable platform for demanding FPGA-based designs.

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