1SG250HH3F55E1VG

The 1SG250HH3F55E1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2912-FBGA package designed for high-performance, bandwidth‑intensive designs. Built on the Stratix 10 family architecture, it leverages the series' Hyperflex core innovations and 14 nm tri‑gate technology to deliver large programmable fabric and embedded resources for demanding compute and connectivity tasks.

This device targets applications requiring extensive logic capacity, large on‑chip memory, and rich I/O — offering a balance of integration, performance, and power efficiency for networking, compute acceleration, and sophisticated system integration.

Key Features

• Large Logic Capacity  Provides 2,500,000 logic elements to implement complex custom logic, packet processing, and large state machines.
• On‑Chip Memory  Includes 204,472,320 total RAM bits to support large buffering, caching, and data‑intensive processing without immediate external memory dependence.
• I/O Density  Offers 1,160 I/O pins to support wide external interfacing and high pin‑count system designs.
• Series-Level Architecture  Based on the Stratix 10 GX family and Intel Hyperflex core architecture, delivering the series' architectural improvements in core performance and clocking.
• Voltage Supply  Core voltage operation specified from 770 mV to 970 mV for predictable power domain planning.
• Package & Mounting  Supplied in a 2912‑FBGA, FC (55×55) package, with surface mount assembly for compact, high‑density board designs.
• Operating Range & Grade  Extended grade device with operating temperature range 0 °C to 100 °C for elevated temperature environments.
• Compliance  RoHS‑compliant to support environmentally regulated manufacturing and assembly processes.

Typical Applications

• High‑Performance Networking and Switching  High logic capacity and abundant I/O make this device suitable for packet processing, forwarding engines, and programmable network functions.
• Data Center Acceleration  Large on‑chip RAM and extensive logic resources enable compute acceleration tasks, data plane offload, and custom hardware acceleration.
• SoC and Embedded Systems  Part of the Stratix 10 family architecture, appropriate for designs that combine programmable fabric with hard IP and embedded processor subsystems.
• High‑Speed Serial Connectivity  Designed for designs requiring extensive I/O and transceiver support typical in backplane, interconnect, and module interfaces.

Unique Advantages

• Massive Programmable Fabric:  2.5 million logic elements allow large, integrated designs that reduce the need for multiple devices and simplify system architecture.
• Significant On‑Chip Memory:  Over 204 million bits of RAM supports large buffering and on‑chip data structures, reducing external memory bandwidth pressure.
• High I/O Count:  1,160 I/Os enable wide parallel interfaces and flexible board‑level connectivity for complex system designs.
• Engineered for Power Domain Planning:  Specified core voltage range (770 mV–970 mV) facilitates predictable power budgeting and supply design.
• Extended Temperature Operation:  Rated 0 °C to 100 °C and Extended grade, suitable for higher temperature applications within that range.
• RoHS Compliant:  Meets environmental requirements for lead‑free assembly processes.

Why Choose 1SG250HH3F55E1VG?

The 1SG250HH3F55E1VG combines the Stratix 10 GX family architecture with a very large logic fabric, extensive on‑chip memory, and high I/O density to address demanding processing and connectivity requirements. Its specifications support designs that need consolidated programmable logic, significant memory resources, and ample external interfacing while operating within a defined voltage and thermal envelope.

This device is well suited for engineering teams developing high‑bandwidth network equipment, data center accelerators, and advanced SoC integrations that require reliable, scalable FPGA resources and the ecosystem benefits of the Stratix 10 family.

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