1SG250HN3F43I3XG

The 1SG250HN3F43I3XG is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 1760-BBGA FCBGA package. It delivers a high-capacity fabric with 2,500,000 logic elements and 204,472,320 bits of embedded RAM to support compute- and memory-intensive designs across industrial applications.

Designed for high-performance embedded and system-level processing, this device combines large logic and memory resources with substantial I/O capability (688 I/Os) and industrial-grade operating range to address demanding bandwidth, signal processing, and control tasks.

Key Features

• Core Architecture  Built on the Intel Stratix 10 family architecture described in the datasheet, including the Hyperflex core innovations that target higher core performance.
• Logic Capacity  2,500,000 logic elements to support large-scale implementations of custom logic, control, and compute pipelines.
• Embedded Memory  204,472,320 total RAM bits for on-chip buffering, frame storage, and working memory for DSP and packet-processing functions.
• I/O Density  688 user I/Os to accommodate wide parallel interfaces, multi-channel data paths, and diverse peripheral connectivity.
• Package  1760-BBGA FCBGA (1760-FBGA, 42.5 × 42.5 mm) for high-density board-level integration.
• Power Supply  Core voltage range 820 mV to 880 mV, enabling low-voltage core operation consistent with high-performance FPGA fabrics.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Compliance  RoHS compliant for regulatory and environmental considerations.

Typical Applications

• High-performance networking and switching  Large logic capacity and abundant I/O enable packet processing, forwarding engines, and protocol acceleration in network equipment.
• Signal processing and RF applications  Extensive on-chip RAM and logic allow implementation of multi-channel DSP pipelines, filtering, and real-time data conditioning.
• Data center and compute acceleration  High logic density supports custom compute kernels, hardware accelerators, and data-path engines for throughput-optimized workloads.
• Industrial control and automation  Industrial temperature rating and robust I/O count make the device suitable for machine control, complex motor drives, and factory automation logic.

Unique Advantages

• Massive on-chip resources: 2.5 million logic elements paired with over 204 million bits of RAM reduce dependence on external memory and simplify high-bandwidth designs.
• High I/O count: 688 I/Os provide flexibility to connect multiple high-speed peripherals, sensors, and interface lanes without complex multiplexing.
• Industrial-ready thermal range: −40 °C to 100 °C operation supports deployment in harsh environments common to industrial and infrastructure systems.
• Compact, high-density package: 1760-BBGA (42.5 × 42.5 mm) balances board area efficiency with the pin count needed for complex systems.
• Low-voltage core operation: 820–880 mV supply supports the device’s core power requirements and can be integrated into modern multi-rail power architectures.
• Regulatory alignment: RoHS compliance aids in meeting environmental and product stewardship requirements.

Why Choose 1SG250HN3F43I3XG?

The 1SG250HN3F43I3XG positions itself for designs that require very large FPGA fabrics, significant on-chip memory, and extensive I/O connectivity within an industrial temperature envelope. Its combination of logic capacity, embedded RAM, and package density makes it suitable for system architects building high-throughput networking, signal processing, and industrial control solutions.

Choosing this Stratix® 10 GX device provides a path to scalable, high-performance implementations with the integration and environmental robustness needed for long-lived installations and complex system designs.

If you would like pricing, lead time, or to request a formal quote for 1SG250HN3F43I3XG, please submit an inquiry or request a quote and our team will respond with up-to-date availability and ordering options.