1SG250HU1F50E1VG

The 1SG250HU1F50E1VG is an Intel Stratix® 10 GX field-programmable gate array (FPGA) in a 2397-BBGA (FCBGA) package. It provides 2,500,000 logic elements with 204,472,320 bits of on-chip RAM and 704 user I/Os, enabling high-capacity programmable logic for advanced systems.

Built on the Stratix 10 family architecture, the device leverages Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology (family-level features) to address designs that require a combination of compute density, high-speed I/O and on-chip memory bandwidth.

Key Features

• Core architecture  Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) process technology (family-level features) that support higher core performance for advanced FPGA designs.
• Logic capacity  2,500,000 logic elements, providing large-scale programmable fabric for complex logic implementations.
• On-chip memory  204,472,320 total RAM bits of embedded memory to support large buffering, lookup and state-storage requirements.
• I/O and connectivity  704 user I/Os available; Stratix 10 family includes advanced transceiver and hard IP features (family-level) such as PCI Express Gen3 support and high-speed transceivers for demanding I/O throughput.
• DSP and compute resources  Family-level variable-precision DSP blocks and fixed/floating-point capabilities designed to accelerate signal processing and compute kernels.
• Package and mounting  2397-BBGA (FCBGA) package, Supplier device package 2397-FBGA, FC (50×50); surface-mount mounting type for board-level integration.
• Power  Supply voltage range 770 mV to 970 mV to meet core power requirements.
• Operating conditions  Extended grade with an operating temperature range of 0 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• Data center acceleration  High logic density and abundant on-chip RAM support compute acceleration, custom offload engines and data-path acceleration tasks.
• High-speed networking  Large I/O count combined with family-level high-speed transceiver and PCI Express hard IP make the device suitable for switches, routers and line cards requiring substantial bandwidth.
• Telecommunications and backplane systems  High logic capacity, embedded memory and advanced I/O support complex protocol processing and multi-protocol aggregation in telecom infrastructure.
• Signal processing and RF front ends  On-chip memory and family-level DSP resources enable implementation of high-throughput digital signal processing pipelines.

Unique Advantages

• Large programmable fabric: 2,500,000 logic elements allow consolidation of complex logic and multiple functions into a single device, reducing system component count.
• Substantial on-chip memory: Over 204 million bits of RAM provide extensive buffering and local storage to improve data-path efficiency and reduce external memory dependence.
• High I/O capacity: 704 user I/Os give designers flexibility to interface with diverse peripherals, memory devices and high-speed links.
• Advanced family-level IP and architecture: Stratix 10 family innovations—such as Hyperflex core architecture and hard IP options—support high-performance compute and connectivity demands.
• Robust package and thermal window: 2397-BBGA package and extended-grade (0 °C to 100 °C) operation simplify integration into thermally managed systems.
• Regulatory readiness: RoHS compliance supports use in products targeting global markets with hazardous-substance restrictions.

Why Choose 1SG250HU1F50E1VG?

1SG250HU1F50E1VG positions itself for designs that require very high logic density, significant on-chip memory and broad I/O capability within a Stratix 10 GX FPGA form factor. Its combination of 2.5 million logic elements, 204,472,320 RAM bits and 704 I/Os provides a platform suitable for advanced compute, networking and signal-processing applications.

Designed as part of the Stratix 10 family, the device benefits from family-level architectural innovations and supporting documentation, enabling engineering teams to scale and optimize complex designs while leveraging familiar development resources.

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