1SG250HU1F50E2VG

The 1SG250HU1F50E2VG is an Intel Stratix® 10 GX field‑programmable gate array in a 2397‑BBGA (FCBGA) package, delivering a high logic capacity device with 2,500,000 logic elements and 704 I/O. It is built on the Stratix 10 family architecture, which incorporates the Intel Hyperflex core architecture and 14 nm tri‑gate process innovations described for the series.

Targeted at high‑bandwidth, compute‑intensive applications, this device combines large on‑chip RAM (204,472,320 bits), extensive I/O and packaging density to address advanced networking, acceleration and programmable system designs while operating within a 0 °C to 100 °C range and a core supply window of 770 mV to 970 mV.

Key Features

• Core & architecture  Intel Stratix 10 family technology based on the Intel Hyperflex core architecture and 14 nm tri‑gate process as described for the device series.
• Logic capacity  2,500,000 logic elements providing large fabric resources for complex designs and high integration density.
• On‑chip memory  204,472,320 total RAM bits to support large buffering, tables and state storage without external memory for many functions.
• I/O and package  704 I/O pins in a 2397‑BBGA (FCBGA) supplier package (2397‑FBGA, FC, 50×50), enabling high‑density board routing and broad peripheral connectivity.
• Power supply  Core operating supply range of 770 mV to 970 mV to match system power planning and regulator requirements for Stratix 10 devices.
• Operating range & grade  Extended grade device rated for operation from 0 °C to 100 °C and RoHS compliance for regulatory alignment.
• Series capabilities (Stratix 10 GX)  Series features include high‑performance transceiver and hard IP options, fractional PLLs, hard memory controllers and advanced DSP and SoC variants as documented for Stratix 10 GX/SX devices.

Typical Applications

• High‑speed networking and switching  Large logic capacity and extensive I/O enable implementation of switch fabrics, packet processing and line‑rate protocol offload within demanding networking equipment.
• Data center acceleration  Significant on‑chip RAM and logic resources support hardware acceleration tasks and custom compute pipelines for data center workloads.
• Telecommunications infrastructure  Series transceiver and hard IP capabilities, combined with high I/O count, suit backplane, optical interface and protocol processing applications.
• Programmable SoC and embedded processing  Stratix 10 family SoC variants and architectural features support designs requiring integrated processor subsystems and tightly coupled FPGA fabric.

Unique Advantages

• Massive programmable fabric: 2,500,000 logic elements let you consolidate functions and reduce external glue logic.
• Large on‑chip memory: 204,472,320 bits of RAM reduce dependence on external memory for buffering and accelerate data‑intensive operations.
• High I/O density in a compact package: 704 I/O in a 2397‑BBGA (50×50) package supports complex board designs with high pin counts.
• Series performance architecture: Leveraging Stratix 10 GX family innovations—such as the Hyperflex core and advanced transceiver/hard IP features—enables high throughput and integration for demanding systems.
• Controlled power window: Core supply range of 770 mV–970 mV provides clear electrical design parameters for power delivery and thermal planning.
• Extended temperature and RoHS compliance: Rated for 0 °C to 100 °C operation and RoHS‑compliant for use in regulated supply chains.

Why Choose 1SG250HU1F50E2VG?

The 1SG250HU1F50E2VG positions you to implement large, high‑performance FPGA designs that require substantial logic, abundant on‑chip memory and high I/O density in a single device. As part of the Intel Stratix 10 GX family, it brings architecture and series‑level capabilities intended for high‑bandwidth, compute‑heavy systems.

This device is well suited to system designers and OEMs building network infrastructure, data center accelerators and embedded SoC solutions who need scalable fabric, dense packaging and clearly defined electrical and thermal operating parameters.

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