1SG250HU1F50I2VG

IC FPGA 704 I/O 2397BGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2500000 2397-BBGA, FCBGA

Quantity 689 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O704Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs312500Number of Logic Elements/Cells2500000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits204472320

Overview of 1SG250HU1F50I2VG – Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 I/O 2397-BBGA, FCBGA

The 1SG250HU1F50I2VG is a Stratix® 10 GX FPGA optimized for high-performance, bandwidth- and compute-intensive designs. Built on Intel’s Stratix 10 family innovations, it combines a high logic-element count with large on-chip memory and a broad I/O complement for demanding system-level integration.

This device targets applications requiring substantial programmable logic, high-speed interfaces and industrial operating range, delivering a mix of performance, integration and configurability enabled by the Stratix 10 family architecture.

Key Features

  • Core Architecture  Intel Stratix 10 family innovations such as the Intel Hyperflex™ core architecture and 14 nm tri-gate (FinFET) technology are part of the family design philosophy described in the product datasheet.
  • Logic Capacity  2,500,000 logic elements (LEs) provide extensive programmable resources for large FPGA designs and complex logic implementation.
  • On‑Chip Memory  204,472,320 total RAM bits enable large buffering, state storage and memory-intensive functions directly on the device.
  • High I/O Count  704 I/O pins support dense external connectivity and multiple parallel interfaces for high‑throughput systems.
  • Transceiver and High‑Speed I/O (family-level)  Stratix 10 family documentation highlights heterogeneous 3D SiP transceiver tiles and transceiver data rates up to 28.3 Gbps for high-speed chip-to-chip and backplane links.
  • Power and Voltage  Core voltage supply range is specified at 770 mV to 970 mV for the device.
  • Package and Mounting  2397‑BBGA (FCBGA) package; supplier device package listed as 2397‑FBGA, FC (50×50). Surface-mount mounting type.
  • Industrial Grade and Temperature Range  Industrial grade device with specified operating temperature of −40°C to 100°C.
  • Standards and IP (family-level)  Family documentation includes hard IP options such as PCI Express Gen3 and 10G Ethernet hard IP in the Stratix 10 family overview.
  • Compliance  RoHS compliant.

Typical Applications

  • Data Center Networking  High logic capacity, large on-chip memory and family-level high-speed transceivers support packet processing, switching and network acceleration functions.
  • High‑Performance Computing & Acceleration  Dense logic resources and substantial RAM bits enable hardware acceleration, custom compute engines and DSP-intensive workloads.
  • Telecommunications & Backplane Systems  Family-level transceiver capabilities plus 704 I/Os allow implementation of multi-lane backplane interfaces and protocol bridging.
  • Industrial Systems  Industrial-grade temperature range (−40°C to 100°C) and surface-mount FCBGA packaging make this device suitable for robust embedded and industrial control platforms.
  • Memory Interface and Storage Controllers  Large on-chip memory and family hard memory controller IP described in the datasheet support DDR4 interfaces and memory-centric designs.

Unique Advantages

  • Large Programmable Fabric:  2,500,000 logic elements enable sizable, consolidated FPGA designs that reduce the need for multiple devices.
  • Substantial On‑Chip Memory:  Over 204 million bits of RAM provide headroom for buffering, large state machines and memory-heavy algorithms without external RAM dependence.
  • Extensive External Connectivity:  704 I/Os accommodate multiple parallel interfaces and complex system interconnects from a single device.
  • Industrial Temperature Range:  Specified −40°C to 100°C operation supports deployment in temperature-challenging environments.
  • Compact High‑Density Package:  2397‑BBGA (FCBGA) packaging supports high pin count in a compact footprint for dense board designs.
  • Family-Level High-Speed Capabilities:  Stratix 10 family features such as heterogeneous 3D SiP transceivers and high-speed serial links provide a roadmap for integration of demanding high-bandwidth interfaces.

Why Choose 1SG250HU1F50I2VG?

The 1SG250HU1F50I2VG delivers a combination of high logic density, large on-chip RAM and extensive I/O in an industrial-grade Stratix 10 GX FPGA package. It is well suited for systems that require significant programmable resources alongside robust operating-range specifications, enabling consolidation of complex functions onto a single device.

For designers focused on bandwidth, compute and integration, this Stratix 10 GX device provides verified family-level innovations and device-level specifications that support scalable, long-lived designs backed by the Stratix 10 documentation set.

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