1SG250HU1F50I2VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2500000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 689 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 704 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 312500 | Number of Logic Elements/Cells | 2500000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 204472320 |
Overview of 1SG250HU1F50I2VG – Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 I/O 2397-BBGA, FCBGA
The 1SG250HU1F50I2VG is a Stratix® 10 GX FPGA optimized for high-performance, bandwidth- and compute-intensive designs. Built on Intel’s Stratix 10 family innovations, it combines a high logic-element count with large on-chip memory and a broad I/O complement for demanding system-level integration.
This device targets applications requiring substantial programmable logic, high-speed interfaces and industrial operating range, delivering a mix of performance, integration and configurability enabled by the Stratix 10 family architecture.
Key Features
- Core Architecture Intel Stratix 10 family innovations such as the Intel Hyperflex™ core architecture and 14 nm tri-gate (FinFET) technology are part of the family design philosophy described in the product datasheet.
- Logic Capacity 2,500,000 logic elements (LEs) provide extensive programmable resources for large FPGA designs and complex logic implementation.
- On‑Chip Memory 204,472,320 total RAM bits enable large buffering, state storage and memory-intensive functions directly on the device.
- High I/O Count 704 I/O pins support dense external connectivity and multiple parallel interfaces for high‑throughput systems.
- Transceiver and High‑Speed I/O (family-level) Stratix 10 family documentation highlights heterogeneous 3D SiP transceiver tiles and transceiver data rates up to 28.3 Gbps for high-speed chip-to-chip and backplane links.
- Power and Voltage Core voltage supply range is specified at 770 mV to 970 mV for the device.
- Package and Mounting 2397‑BBGA (FCBGA) package; supplier device package listed as 2397‑FBGA, FC (50×50). Surface-mount mounting type.
- Industrial Grade and Temperature Range Industrial grade device with specified operating temperature of −40°C to 100°C.
- Standards and IP (family-level) Family documentation includes hard IP options such as PCI Express Gen3 and 10G Ethernet hard IP in the Stratix 10 family overview.
- Compliance RoHS compliant.
Typical Applications
- Data Center Networking High logic capacity, large on-chip memory and family-level high-speed transceivers support packet processing, switching and network acceleration functions.
- High‑Performance Computing & Acceleration Dense logic resources and substantial RAM bits enable hardware acceleration, custom compute engines and DSP-intensive workloads.
- Telecommunications & Backplane Systems Family-level transceiver capabilities plus 704 I/Os allow implementation of multi-lane backplane interfaces and protocol bridging.
- Industrial Systems Industrial-grade temperature range (−40°C to 100°C) and surface-mount FCBGA packaging make this device suitable for robust embedded and industrial control platforms.
- Memory Interface and Storage Controllers Large on-chip memory and family hard memory controller IP described in the datasheet support DDR4 interfaces and memory-centric designs.
Unique Advantages
- Large Programmable Fabric: 2,500,000 logic elements enable sizable, consolidated FPGA designs that reduce the need for multiple devices.
- Substantial On‑Chip Memory: Over 204 million bits of RAM provide headroom for buffering, large state machines and memory-heavy algorithms without external RAM dependence.
- Extensive External Connectivity: 704 I/Os accommodate multiple parallel interfaces and complex system interconnects from a single device.
- Industrial Temperature Range: Specified −40°C to 100°C operation supports deployment in temperature-challenging environments.
- Compact High‑Density Package: 2397‑BBGA (FCBGA) packaging supports high pin count in a compact footprint for dense board designs.
- Family-Level High-Speed Capabilities: Stratix 10 family features such as heterogeneous 3D SiP transceivers and high-speed serial links provide a roadmap for integration of demanding high-bandwidth interfaces.
Why Choose 1SG250HU1F50I2VG?
The 1SG250HU1F50I2VG delivers a combination of high logic density, large on-chip RAM and extensive I/O in an industrial-grade Stratix 10 GX FPGA package. It is well suited for systems that require significant programmable resources alongside robust operating-range specifications, enabling consolidation of complex functions onto a single device.
For designers focused on bandwidth, compute and integration, this Stratix 10 GX device provides verified family-level innovations and device-level specifications that support scalable, long-lived designs backed by the Stratix 10 documentation set.
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