1SG250HU1F50I2LG

The 1SG250HU1F50I2LG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 2397-BBGA FCBGA package. It delivers large programmable logic capacity and high I/O density for demanding, high-throughput embedded and systems applications.

Built on the Stratix 10 family architecture, the device combines the Hyperflex core architecture and 14 nm tri‑gate (FinFET) process innovations described for the family with device-level specifications including 2,500,000 logic elements, 204,472,320 bits of on-chip RAM, and 704 I/O. These attributes make it suitable for advanced networking, compute acceleration, and industrial systems that require significant programmable logic, memory, and I/O resources.

Key Features

• Core Architecture  Stratix 10 family features including the Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology are part of the device family specification.
• Logic Capacity  2,500,000 logic elements provide substantial programmable fabric for large-scale logic implementations.
• On‑Chip Memory  204,472,320 total RAM bits support large buffering, lookup tables, and state storage directly on chip.
• I/O Density  704 device I/O pins accommodate wide parallel interfaces and extensive external connectivity.
• Power Rail  Core voltage supply range of 820 mV–880 mV, matching high-performance FPGA core requirements.
• Package & Mounting  2397‑BBGA (FCBGA) supplier device package (2397‑FBGA, FC, 50 × 50) in a surface-mount form factor for system-level integration.
• Operating Range & Grade  Industrial grade device rated for operation from −40°C to 100°C for use in temperature-challenging environments.
• Family Features (Series)  Stratix 10 family innovations called out in the device overview include high-performance DSP capability, hard IP blocks for PCIe and Ethernet, and scalable transceiver technology as applicable to the family.

Typical Applications

• High‑Performance Networking  Large logic capacity and high I/O count enable packet processing, switch/router fabric implementation, and protocol offload in networking equipment.
• Data Center Acceleration  Significant on‑chip memory and programmable logic make this device suitable for hardware acceleration tasks such as compression, encryption, and custom compute kernels.
• Telecommunications & Transport  Designed for throughput‑intensive interfaces and system-level integration where large logic and memory resources are required for protocol processing and forwarding.
• Industrial Systems  Industrial temperature rating and robust package options support control, test, and measurement equipment that must operate across wide temperature ranges.

Unique Advantages

• Massive Programmable Fabric:  2.5 million logic elements let designers implement large, complex hardware functions on a single device, reducing board-level partitioning.
• Large On‑Chip Memory:  Over 204 million bits of RAM enable extensive buffering and stateful processing without relying on external memory for many functions.
• High I/O Count:  704 I/O pins support broad parallel interfaces and simplify connection to wide data buses and multiple peripherals.
• Industrial Temperature Capability:  Rated from −40°C to 100°C to meet environmental demands in industrial deployments.
• Compact Surface‑Mount Package:  2397‑BBGA FCBGA package provides a high‑density implementation option for space-constrained systems.
• Controlled Core Voltage Range:  820 mV–880 mV core supply specification aligns with high-performance FPGA power domains and design planning.

Why Choose 1SG250HU1F50I2LG?

The 1SG250HU1F50I2LG positions itself for system designs that require substantial programmable logic, deep on‑chip memory, and broad I/O integration within a single Stratix 10 GX device package. Its device-level specifications—2,500,000 logic elements, 204,472,320 RAM bits, 704 I/O, industrial temperature rating, and a 2397‑BBGA surface-mount package—deliver a strong foundation for building high-throughput, memory‑intensive, and ruggedized systems.

Engineers and procurement teams seeking a high‑capacity FPGA for advanced networking, compute acceleration, or industrial applications will find the device offers a combination of scale, integration, and family-level performance features suitable for complex designs and long-term platform development.

Request a quote or submit an inquiry to get pricing and availability for 1SG250HU1F50I2LG and to discuss how it fits your next development project.