1SG250HU2F50I2VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2500000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 424 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 704 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 312500 | Number of Logic Elements/Cells | 2500000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 204472320 |
Overview of 1SG250HU2F50I2VG – Stratix® 10 GX Field Programmable Gate Array (FPGA) IC, 704 I/Os, 2,500,000 logic elements, 2397-BBGA
The 1SG250HU2F50I2VG is an Intel Stratix® 10 GX-series FPGA optimized for high-density, high-performance logic and memory integration. Built on the Stratix 10 GX family architecture, the device combines a large logic fabric, extensive embedded RAM, and broad I/O to address demanding communications, compute acceleration, and advanced signal-processing applications.
Targeted at industrial-grade systems, this FCBGA surface-mount device offers a wide operating temperature range and a low core-voltage operating window, delivering a compact, high-capacity programmable platform for designs that require large logic capacity, substantial on-chip RAM, and extensive I/O connectivity.
Key Features
- Logic Capacity Provides 2,500,000 logic elements suitable for large, complex designs and high-density integration.
- Embedded Memory Includes 204,472,320 total RAM bits to support large buffering, on-chip data storage, and memory-rich algorithms.
- I/O Density Features 704 I/O pins to enable extensive external connectivity for high-channel-count systems and multi‑lane interfaces.
- Stratix 10 GX Architecture Leverages the Stratix 10 GX family innovations documented for the series, including the Intel Hyperflex core architecture and heterogeneous 3D SiP transceiver tiles for high-performance logic and transceiver integration.
- Power and Voltage Core supply operation between 770 mV and 970 mV, enabling designs that target the specified low-voltage operating range.
- Package and Mounting 2397-BBGA FCBGA package (supplier device package: 2397-FBGA, FC 50×50) in a surface-mount form factor for board-level integration.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for reliable performance in industrial environments.
- Regulatory RoHS compliant.
Typical Applications
- High‑Performance Networking Large logic capacity, extensive on-chip RAM, and high I/O count make this device suitable for packet processing, protocol offload, and multi‑lane networking line cards.
- Data Center Acceleration Meets compute‑intensive FPGA acceleration needs where significant programmable fabric and memory are required for custom algorithms and data buffering.
- Test & Measurement High logic density and abundant I/O support instrument control, real‑time data acquisition, and high‑throughput signal processing tasks.
- Imaging and Signal Processing Large embedded RAM and logic resources support complex processing pipelines for advanced imaging, video processing, and sensor fusion.
Unique Advantages
- High Logic Density: 2,500,000 logic elements enable consolidation of large subsystems into a single FPGA, reducing board complexity.
- Substantial On‑Chip Memory: 204,472,320 bits of RAM provide significant local storage for buffering and data‑intensive algorithms, minimizing external memory dependency.
- Extensive I/O Count: 704 I/Os support multiple parallel interfaces and high channel counts without external multiplexing.
- Industrial Temperature Range: Certified operation from −40 °C to 100 °C supports deployment in industrial and harsh environments.
- Compact FCBGA Package: 2397-pin FCBGA (50×50) provides a high‑pin‑count solution in a board‑friendly surface‑mount package for dense system designs.
- RoHS Compliant: Meets environmental compliance expectations for modern hardware production.
Why Choose 1SG250HU2F50I2VG?
The 1SG250HU2F50I2VG brings large-scale programmable logic, extensive embedded memory, and broad I/O capability in an industrial‑grade, surface‑mount FCBGA package. It is well suited for system designers who need to implement complex data paths, large buffering, and dense interface connectivity within a single FPGA device.
Choosing this Stratix 10 GX device benefits projects that require high integration density, long-term robustness in industrial environments, and alignment with the Stratix 10 family architecture documented for high-performance applications.
Request a quote or submit an RFQ to obtain pricing, availability, and detailed procurement information for the 1SG250HU2F50I2VG.

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