1SG250HU2F50I2VG

IC FPGA 704 I/O 2397BGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2500000 2397-BBGA, FCBGA

Quantity 424 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O704Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs312500Number of Logic Elements/Cells2500000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits204472320

Overview of 1SG250HU2F50I2VG – Stratix® 10 GX Field Programmable Gate Array (FPGA) IC, 704 I/Os, 2,500,000 logic elements, 2397-BBGA

The 1SG250HU2F50I2VG is an Intel Stratix® 10 GX-series FPGA optimized for high-density, high-performance logic and memory integration. Built on the Stratix 10 GX family architecture, the device combines a large logic fabric, extensive embedded RAM, and broad I/O to address demanding communications, compute acceleration, and advanced signal-processing applications.

Targeted at industrial-grade systems, this FCBGA surface-mount device offers a wide operating temperature range and a low core-voltage operating window, delivering a compact, high-capacity programmable platform for designs that require large logic capacity, substantial on-chip RAM, and extensive I/O connectivity.

Key Features

  • Logic Capacity  Provides 2,500,000 logic elements suitable for large, complex designs and high-density integration.
  • Embedded Memory  Includes 204,472,320 total RAM bits to support large buffering, on-chip data storage, and memory-rich algorithms.
  • I/O Density  Features 704 I/O pins to enable extensive external connectivity for high-channel-count systems and multi‑lane interfaces.
  • Stratix 10 GX Architecture  Leverages the Stratix 10 GX family innovations documented for the series, including the Intel Hyperflex core architecture and heterogeneous 3D SiP transceiver tiles for high-performance logic and transceiver integration.
  • Power and Voltage  Core supply operation between 770 mV and 970 mV, enabling designs that target the specified low-voltage operating range.
  • Package and Mounting  2397-BBGA FCBGA package (supplier device package: 2397-FBGA, FC 50×50) in a surface-mount form factor for board-level integration.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for reliable performance in industrial environments.
  • Regulatory  RoHS compliant.

Typical Applications

  • High‑Performance Networking  Large logic capacity, extensive on-chip RAM, and high I/O count make this device suitable for packet processing, protocol offload, and multi‑lane networking line cards.
  • Data Center Acceleration  Meets compute‑intensive FPGA acceleration needs where significant programmable fabric and memory are required for custom algorithms and data buffering.
  • Test & Measurement  High logic density and abundant I/O support instrument control, real‑time data acquisition, and high‑throughput signal processing tasks.
  • Imaging and Signal Processing  Large embedded RAM and logic resources support complex processing pipelines for advanced imaging, video processing, and sensor fusion.

Unique Advantages

  • High Logic Density:  2,500,000 logic elements enable consolidation of large subsystems into a single FPGA, reducing board complexity.
  • Substantial On‑Chip Memory:  204,472,320 bits of RAM provide significant local storage for buffering and data‑intensive algorithms, minimizing external memory dependency.
  • Extensive I/O Count:  704 I/Os support multiple parallel interfaces and high channel counts without external multiplexing.
  • Industrial Temperature Range:  Certified operation from −40 °C to 100 °C supports deployment in industrial and harsh environments.
  • Compact FCBGA Package:  2397-pin FCBGA (50×50) provides a high‑pin‑count solution in a board‑friendly surface‑mount package for dense system designs.
  • RoHS Compliant:  Meets environmental compliance expectations for modern hardware production.

Why Choose 1SG250HU2F50I2VG?

The 1SG250HU2F50I2VG brings large-scale programmable logic, extensive embedded memory, and broad I/O capability in an industrial‑grade, surface‑mount FCBGA package. It is well suited for system designers who need to implement complex data paths, large buffering, and dense interface connectivity within a single FPGA device.

Choosing this Stratix 10 GX device benefits projects that require high integration density, long-term robustness in industrial environments, and alignment with the Stratix 10 family architecture documented for high-performance applications.

Request a quote or submit an RFQ to obtain pricing, availability, and detailed procurement information for the 1SG250HU2F50I2VG.

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