1SG250HU3F50E3VG

IC FPGA 704 I/O 2397BGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2500000 2397-BBGA, FCBGA

Quantity 539 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O704Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs312500Number of Logic Elements/Cells2500000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits204472320

Overview of 1SG250HU3F50E3VG – Stratix® 10 GX FPGA, 2,500,000 Logic Elements, 704 I/O, 2397-BBGA

The 1SG250HU3F50E3VG is a Stratix® 10 GX field programmable gate array (FPGA) provided in a 2397-BBGA FCBGA package. Built on the Stratix 10 GX family architecture, this device combines a high logic capacity with large on-chip RAM and extensive I/O to address demanding bandwidth and processing applications.

This device is targeted at applications requiring high core performance and system integration, offering up to 2,500,000 logic elements, 204,472,320 bits of on-chip RAM, and 704 I/O pins. The device operates over a 770 mV to 970 mV core supply range and an ambient operating temperature of 0 °C to 100 °C.

Key Features

  • Logic Capacity  Contains 2,500,000 logic elements suitable for large-scale programmable designs.
  • On-chip Memory  Total RAM of 204,472,320 bits for high-bandwidth buffering and local storage.
  • I/O and Packaging  704 I/O pins in a surface-mount 2397-BBGA (2397-FBGA, FC 50×50) package for dense board-level integration.
  • Power Supply Range  Core voltage supply range of 770 mV to 970 mV to match system power architectures.
  • Operating Grade and Temperature  Extended grade device with an operating temperature range of 0 °C to 100 °C.
  • Stratix 10 Family Innovations  Leverages the Stratix 10 architecture including the Intel Hyperflex core and Intel 14 nm tri-gate (FinFET) technology as described for the device family.
  • High‑Speed Serial and System Features (Family‑level)  Stratix 10 GX family devices include heterogeneous 3D SiP transceiver tiles and transceiver data rates up to 28.3 Gbps, plus hard protocol IP such as PCI Express and 10G/40G Ethernet—features described in the family overview.
  • Mounting  Surface mount design supports modern PCB assembly processes.

Typical Applications

  • High‑Speed Networking and Switches  Use with high‑bandwidth serial interfaces and family-level transceiver capability to implement packet processing, switching, and line cards.
  • Telecommunications Infrastructure  Deploy in network equipment where large logic resources and on-chip RAM support complex framing, buffering, and protocol handling.
  • Data Center Acceleration  Implement custom accelerators and data-path processing leveraging the device’s large logic capacity and memory.
  • Signal Processing and DSP  Support compute‑intensive signal processing functions using the device’s capacity for large-scale logic and embedded resources.

Unique Advantages

  • High Logic Density:  2,500,000 logic elements enable complex, consolidated designs and reduce the need for multiple devices.
  • Large On‑Chip Memory:  204,472,320 bits of RAM provide substantial local storage for buffering and algorithm state without external memory.
  • Extensive I/O Count:  704 I/O pins in a compact 2397-BBGA package allow dense system connectivity and flexible board routing.
  • Family-Level Performance Innovations:  Built on the Stratix 10 GX family architecture with Hyperflex core and 14 nm FinFET technology as described in the device overview for improved core performance.
  • Surface-Mount Package:  FCBGA mounting simplifies integration into modern high-density PCBs and assembly flows.
  • Extended Operating Range:  Extended grade with 0 °C to 100 °C operation supports deployment in controlled commercial and data-center environments.

Why Choose 1SG250HU3F50E3VG?

The 1SG250HU3F50E3VG positions itself for designs that require very high logic capacity, significant on-chip memory, and broad I/O connectivity in a compact surface-mount package. As a member of the Stratix 10 GX family, it benefits from the family-level architectural innovations described in the device overview, delivering a platform suitable for bandwidth‑and compute‑intensive systems.

This device is well suited to engineering teams building advanced networking, compute acceleration, and signal-processing systems that need consolidated logic resources, large embedded memory, and a high I/O count. Its extended grade and specified supply and temperature ranges support reliable operation within defined commercial and data-center environments.

Request a quote or submit a quote for the 1SG250HU3F50E3VG to begin procurement and evaluate this Stratix® 10 GX FPGA for your next high‑performance design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up