1SG250HU3F50I1VG

The 1SG250HU3F50I1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) offered in a 2397-BBGA FCBGA package and rated for industrial operation. It combines a high logic density fabric with large on-chip memory and a broad I/O complement to address high-bandwidth, high-performance FPGA applications.

Built on the Stratix® 10 family architecture, the device targets advanced networking, data processing and compute-accelerated designs that require extensive programmable logic, high memory capacity, and flexible I/O connectivity while operating across a wide industrial temperature range.

Key Features

• Core Capacity  Provides 2,500,000 logic elements for complex custom logic implementation and large-scale integration on a single device.
• On-chip Memory  Contains 204,472,320 total RAM bits to support large buffering, packet processing, and on-device data storage.
• I/O Density  Offers 704 I/O pins, enabling extensive external interfacing for high-channel-count systems and dense board-level integration.
• Package and Mounting  Supplied in a 2397-BBGA, FCBGA package (supplier package: 2397-FBGA, FC 50×50) with surface-mount mounting for compact, high-density PCB layouts.
• Power Supply  Operates from a core voltage supply range of 770 mV to 970 mV, suitable for the device’s specified power architecture.
• Operating Temperature  Industrial grade operation from −40°C to 100°C for deployment in temperature-challenging environments.
• Series Architecture  Leverages Stratix® 10 innovations such as the Intel Hyperflex™ core architecture and 14 nm process technology as part of the family-level feature set.
• Compliance  RoHS compliant, supporting restricted-substance requirements for modern electronics manufacturing.

Typical Applications

• High-performance Networking  Large logic capacity and extensive on-chip memory make this FPGA suitable for packet processing, switching, and line-rate networking functions.
• Data Center Acceleration  High logic density and I/O count enable custom accelerators and offload engines for compute and storage tasks.
• Telecommunications Infrastructure  Designed for bandwidth-intensive functions and protocol processing where large memory buffers and many I/Os are required.
• Embedded Compute and Signal Processing  On-chip memory and deep logic resources support complex DSP and data-path designs within industrial systems.

Unique Advantages

• High logic density: 2,500,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level BOM and system complexity.
• Substantial on-chip RAM: 204,472,320 total RAM bits provide large local storage for buffering, tables, and state, minimizing external memory dependence.
• Extensive I/O capability: 704 I/O pins support high channel counts and flexible interfacing with peripherals, transceivers, and memory subsystems.
• Industrial temperature rating: −40°C to 100°C operation ensures suitability for demanding ambient environments and industrial deployments.
• Compact, production-ready package: 2397-BBGA FCBGA surface-mount package supports high-density PCBs and repeatable manufacturing processes.
• Regulatory conformance: RoHS compliance aligns with modern lead-free manufacturing and environmental requirements.

Why Choose 1SG250HU3F50I1VG?

The 1SG250HU3F50I1VG positions itself where high logic capacity, large on-chip memory, and broad I/O are essential. Its Stratix® 10 GX family heritage and Intel Hyperflex™ core architecture (as described in the family documentation) provide a platform suited to demanding networking, data center, telecom and embedded compute designs that need compact, high-density FPGA solutions.

Engineers and system designers will find this device appropriate for consolidating complex functions, implementing large buffers and data paths on-chip, and deploying in industrial environments that require reliable temperature performance and RoHS-compliant devices.

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