1SG250HU3F50E2LG

The 1SG250HU3F50E2LG is an Intel Stratix® 10 GX field-programmable gate array (FPGA) packaged in a 2397-BBGA FCBGA. It delivers very high logic capacity and large on-chip memory, targeting advanced designs that require high integration density, abundant I/O, and predictable operating characteristics.

As part of the Stratix 10 family, this device leverages family-level innovations such as the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) technology to address high-bandwidth and high-performance applications while providing power-optimized core voltage operation.

Key Features

• Logic Capacity 2,500,000 logic elements (logic cells) for implementing large, complex designs and high-density integration.
• On‑chip Memory 204,472,320 total RAM bits of internal memory to support large buffers, FIFOs, and embedded data structures.
• I/O and Integration 704 I/O pins provide broad interface connectivity for multi-channel systems and complex board-level integration.
• Package & Mounting 2397-BBGA, FCBGA package (supplier package: 2397-FBGA, FC 50×50) with surface-mount mounting for high-density board designs.
• Operating Conditions Extended grade with an operating temperature range of 0°C to 100°C and RoHS compliance for regulatory alignment.
• Core Power Specified voltage supply range of 820 mV to 880 mV for the device core.
• Stratix 10 Family Innovations Family-level features include the Intel Hyperflex core architecture, 14 nm FinFET process, heterogeneous 3D SiP transceiver tiles, M20K internal SRAM blocks, and a broad set of hard IP blocks (for example, PCI Express and 10G/40G Ethernet), as documented in the Stratix 10 device overview.

Typical Applications

• High‑performance networking and backplane systems Large logic capacity, family-level high-speed transceiver capability, and abundant I/O support complex packet processing, switching, and backplane interfaces.
• Data center acceleration High logic element count and substantial on-chip RAM enable implementation of custom accelerators and high-throughput data paths.
• Telecommunications infrastructure Extensive I/O and family-level hard IP for high-speed serial links and FEC align with telecom line card and aggregation applications.
• Test, measurement and signal processing Large embedded memory and dense logic resources support deep buffering, real-time processing, and algorithm acceleration.

Unique Advantages

• Very high logic density: 2,500,000 logic elements allow integration of multiple subsystems into a single device, reducing board-level complexity.
• Massive on‑chip RAM: 204,472,320 bits of internal RAM minimize external memory dependence for latency-sensitive applications.
• High I/O count: 704 I/Os enable direct interfacing to numerous peripherals, lanes, and system buses without extensive multiplexing.
• Optimized core power window: Core voltage supply specified between 820 mV and 880 mV supports predictable power budgeting in system designs.
• Robust package and mounting: 2397-BBGA FCBGA in a 50×50 footprint offers a high-density mounting option for compact, high-pin-count boards.
• Extended operating range: 0°C to 100°C grade supports deployment in a range of controlled-environment applications.

Why Choose 1SG250HU3F50E2LG?

The 1SG250HU3F50E2LG positions itself for advanced FPGA designs that demand very high logic capacity, extensive on-chip memory, and substantial I/O connectivity. Combined with Stratix 10 family-level architectural innovations, it provides a platform suited for integrating complex processing, high-throughput data movement, and dense system logic into a single device.

This part is appropriate for engineering teams building scalable, high-performance systems that require consolidation of functions, large local memory, and flexible interfacing while operating within the specified core voltage and extended temperature range. Its compliance and package choices support modern board designs and supply-chain requirements.

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