1SG250HU3F50E2VG

The 1SG250HU3F50E2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2397-BBGA surface-mount package. It combines a high core logic capacity with a large on-chip RAM complement and a substantial I/O count, targeting demanding designs that require high bandwidth, dense logic integration, and flexible system integration.

Built on the Stratix 10 family architecture, this device leverages the series’ advanced core architecture and performance-oriented features to address high-performance networking, compute acceleration, and complex system integration tasks while operating within a low-voltage core range.

Key Features

• Core Logic 2,500,000 logic elements (logic element cells) provide substantial programmable capacity for large, complex designs.
• On-chip Memory 204,472,320 total RAM bits of embedded memory to support large buffering, packet processing, and dataflow tasks.
• I/O Density 704 I/O pins support extensive interfacing to high-pin-count peripherals, memory, and multi-lane transceiver arrangements.
• Advanced Architecture Based on the Intel Stratix 10 family innovations (including the Hyperflex core architecture and Intel 14 nm process) to enable high core performance and integration.
• Power and Core Voltage Core supply range of 770 mV to 970 mV for the device core domain, consistent with low-voltage high-performance FPGA operation.
• Package and Mounting 2397-BBGA (FCBGA) supplier device package specified as 2397-FBGA, FC (50×50) with surface-mount mounting suitable for compact board-level implementations.
• Operating Range & Grade Extended-grade device with an operating temperature range of 0 °C to 100 °C, suitable for many commercial and industrial-adjacent applications.
• Environmental Compliance RoHS compliant.

Typical Applications

• High‑Performance Networking and Switching Large logic capacity and high on-chip RAM make the device suitable for packet processing, protocol offload, and line-rate switching functions.
• Data Center Acceleration The combination of dense logic and significant memory supports hardware acceleration for compute-heavy workloads and data-path processing.
• High‑Speed Backplane and Optical Modules High I/O count enables multi-lane connectivity and complex interface routing required in backplane and optical communication systems.
• DSP and Signal Processing Large embedded RAM and abundant logic resources support streaming, buffering, and algorithm implementation for high-throughput signal processing.

Unique Advantages

• Massive Logic Capacity: 2.5 million logic elements enable implementation of large FPGA designs without partitioning across multiple devices.
• Substantial On‑Chip Memory: Over 204 million RAM bits reduce reliance on external memory for buffering and enable lower-latency data paths.
• High I/O Count: 704 I/O pins support complex system interfaces and high-bandwidth multi-lane connections.
• Low‑Voltage Core Operation: 770 mV–970 mV core supply range aligns with modern low-power FPGA design practices.
• Compact, High‑Density Package: 2397-BBGA (50×50) surface-mount package concentrates resources in a board-friendly footprint for space-constrained systems.
• Extended Temperature Grade: Rated 0 °C to 100 °C for applications requiring a wider-than-commercial temperature range.

Why Choose 1SG250HU3F50E2VG?

The 1SG250HU3F50E2VG positions itself as a high-capacity, high-integration Stratix 10 GX FPGA option for systems that demand extensive programmable logic, large on-chip memory, and broad I/O connectivity. Its architecture and family-level innovations deliver the performance and integration needed for networking, acceleration, and high-throughput signal processing designs.

Engineers and system designers seeking a single-device solution for complex, bandwidth-intensive applications will find this device attractive for its scalability, on-chip resources, and package density, while RoHS compliance and extended temperature grading support long-term deployment considerations.

Request a quote or submit a sales inquiry to learn more about availability, pricing, and integration support for the 1SG250HU3F50E2VG.