1SG250HU3F50I2LG

IC FPGA 704 I/O 2397BGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2500000 2397-BBGA, FCBGA

Quantity 507 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O704Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs312500Number of Logic Elements/Cells2500000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits204472320

Overview of 1SG250HU3F50I2LG – Stratix® 10 GX FPGA, 2,500,000 logic elements, 704 I/O (Industrial)

The 1SG250HU3F50I2LG is an Intel Stratix® 10 GX field-programmable gate array (FPGA) in a 2397-BBGA FCBGA package, targeted at advanced, high-bandwidth applications. It combines a large programmable fabric with extensive on-chip memory and I/O, and it is offered in an industrial temperature grade for deployment in demanding environments.

As part of the Stratix® 10 GX family, this device benefits from the family’s architectural innovations including the Intel Hyperflex™ core architecture and 14 nm tri-gate (FinFET) technology, delivering enhanced core performance and efficiency for compute- and bandwidth-intensive designs.

Key Features

  • Core Architecture  Intel Hyperflex™ core architecture (Stratix® 10 family) delivering increased core performance compared to previous-generation high-performance FPGAs.
  • Logic Capacity  2,500,000 logic elements, providing large programmable capacity for complex logic and control functions.
  • On-Chip Memory  204,472,320 total RAM bits to support large buffers, packet processing, and data staging within the FPGA fabric.
  • I/O and Package  704 I/O pins in a 2397-BBGA (FCBGA) package, with a supplier device package dimensioned as 2397-FBGA, FC (50×50) for high-density board integration.
  • Power Supply  Core voltage supply range 820 mV to 880 mV, enabling predictable power budgeting for the device core.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial deployments.
  • Board Mounting and Compliance  Surface-mount device with RoHS compliance.
  • Stratix® 10 Family Capabilities  Family-level features include support for high-speed transceivers, hard PCI Express Gen3 IP blocks, variable-precision DSP blocks, and advanced clocking and memory controller options (as documented for the Stratix® 10 GX/SX family).

Typical Applications

  • High-performance Networking  Use for packet processing, switching, and line-rate networking functions that require large logic capacity and abundant on-chip memory.
  • Data Center Acceleration  Suitable for compute and I/O acceleration tasks where dense logic, large RAM, and high I/O count are needed.
  • Telecommunications and Backplane Systems  Deploy in communication systems that leverage the Stratix® 10 GX family’s high-speed transceiver and protocol IP support.
  • Advanced Signal Processing  Applicable to DSP-heavy workloads using the device’s large logic fabric and embedded memory resources.

Unique Advantages

  • Massive Programmable Capacity: 2,500,000 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
  • Large On-Chip Memory: Over 204 million RAM bits reduce external memory dependence for buffering and local data processing.
  • High I/O Density: 704 I/O pins in a 2397-BBGA package support broad peripheral interfacing and multi-channel system designs.
  • Industrial Reliability: −40 °C to 100 °C operating range and surface-mount packaging support deployment in industrial environments.
  • Family-Proven Innovations: Benefits from Stratix® 10 GX family innovations such as the Hyperflex core architecture and 14 nm FinFET process for improved performance and efficiency.
  • Compliance-Ready: RoHS-compliant construction facilitates use in regulated supply chains.

Why Choose 1SG250HU3F50I2LG?

The 1SG250HU3F50I2LG positions itself where high logic density, abundant on-chip memory, and substantial I/O capability are required alongside industrial temperature operation. It is appropriate for system designers targeting high-bandwidth networking, data center acceleration, and advanced signal-processing applications that leverage Stratix® 10 family innovations.

With a proven family architecture, a defined core voltage window, and a package designed for dense board integration, this device delivers a scalable platform for complex FPGA-based systems while maintaining industry-standard environmental compliance.

Request a quote or submit an inquiry for pricing and availability to begin integration planning and procurement for your next high-performance FPGA design.

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