1SG250HU3F50I2LG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2500000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 507 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 704 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 312500 | Number of Logic Elements/Cells | 2500000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 204472320 |
Overview of 1SG250HU3F50I2LG – Stratix® 10 GX FPGA, 2,500,000 logic elements, 704 I/O (Industrial)
The 1SG250HU3F50I2LG is an Intel Stratix® 10 GX field-programmable gate array (FPGA) in a 2397-BBGA FCBGA package, targeted at advanced, high-bandwidth applications. It combines a large programmable fabric with extensive on-chip memory and I/O, and it is offered in an industrial temperature grade for deployment in demanding environments.
As part of the Stratix® 10 GX family, this device benefits from the family’s architectural innovations including the Intel Hyperflex™ core architecture and 14 nm tri-gate (FinFET) technology, delivering enhanced core performance and efficiency for compute- and bandwidth-intensive designs.
Key Features
- Core Architecture Intel Hyperflex™ core architecture (Stratix® 10 family) delivering increased core performance compared to previous-generation high-performance FPGAs.
- Logic Capacity 2,500,000 logic elements, providing large programmable capacity for complex logic and control functions.
- On-Chip Memory 204,472,320 total RAM bits to support large buffers, packet processing, and data staging within the FPGA fabric.
- I/O and Package 704 I/O pins in a 2397-BBGA (FCBGA) package, with a supplier device package dimensioned as 2397-FBGA, FC (50×50) for high-density board integration.
- Power Supply Core voltage supply range 820 mV to 880 mV, enabling predictable power budgeting for the device core.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial deployments.
- Board Mounting and Compliance Surface-mount device with RoHS compliance.
- Stratix® 10 Family Capabilities Family-level features include support for high-speed transceivers, hard PCI Express Gen3 IP blocks, variable-precision DSP blocks, and advanced clocking and memory controller options (as documented for the Stratix® 10 GX/SX family).
Typical Applications
- High-performance Networking Use for packet processing, switching, and line-rate networking functions that require large logic capacity and abundant on-chip memory.
- Data Center Acceleration Suitable for compute and I/O acceleration tasks where dense logic, large RAM, and high I/O count are needed.
- Telecommunications and Backplane Systems Deploy in communication systems that leverage the Stratix® 10 GX family’s high-speed transceiver and protocol IP support.
- Advanced Signal Processing Applicable to DSP-heavy workloads using the device’s large logic fabric and embedded memory resources.
Unique Advantages
- Massive Programmable Capacity: 2,500,000 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
- Large On-Chip Memory: Over 204 million RAM bits reduce external memory dependence for buffering and local data processing.
- High I/O Density: 704 I/O pins in a 2397-BBGA package support broad peripheral interfacing and multi-channel system designs.
- Industrial Reliability: −40 °C to 100 °C operating range and surface-mount packaging support deployment in industrial environments.
- Family-Proven Innovations: Benefits from Stratix® 10 GX family innovations such as the Hyperflex core architecture and 14 nm FinFET process for improved performance and efficiency.
- Compliance-Ready: RoHS-compliant construction facilitates use in regulated supply chains.
Why Choose 1SG250HU3F50I2LG?
The 1SG250HU3F50I2LG positions itself where high logic density, abundant on-chip memory, and substantial I/O capability are required alongside industrial temperature operation. It is appropriate for system designers targeting high-bandwidth networking, data center acceleration, and advanced signal-processing applications that leverage Stratix® 10 family innovations.
With a proven family architecture, a defined core voltage window, and a package designed for dense board integration, this device delivers a scalable platform for complex FPGA-based systems while maintaining industry-standard environmental compliance.
Request a quote or submit an inquiry for pricing and availability to begin integration planning and procurement for your next high-performance FPGA design.

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