1SG250LN3F43E3XG

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2500000 1760-BBGA, FCBGA

Quantity 687 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs312500Number of Logic Elements/Cells2500000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits204472320

Overview of 1SG250LN3F43E3XG – Stratix® 10 GX FPGA, 2,500,000 logic elements, 688 I/O, 1760-BBGA

The 1SG250LN3F43E3XG is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 1760-BBGA FCBGA package. It targets high-bandwidth, high-performance designs that require large logic capacity, extensive on-chip memory, and abundant I/O.

Part of the Stratix 10 family, this device leverages family innovations such as the Intel Hyperflex core architecture and high‑speed transceiver technology to address demanding applications in networking, data center acceleration, and advanced signal processing.

Key Features

  • Core architecture  Family-level Intel Hyperflex core architecture designed to deliver increased core performance and higher processing efficiency.
  • Logic capacity  2,500,000 logic elements (with 312,500 reported logic clusters/ALM-equivalent) for large, complex FPGA implementations.
  • On-chip memory  204,472,320 total RAM bits to support large buffering, packet processing, and state storage requirements.
  • I/O and interfaces  688 I/O pins to support wide parallel interfaces and dense system connectivity.
  • High-speed transceiver and IP (family-level)  Stratix 10 family documentation describes heterogeneous transceiver tiles and high-rate transceiver options (family features include multi‑Gbps transceivers, hard PCI Express Gen3 x16 IP, and hard 10G/40G Ethernet IP with FEC).
  • DSP and compute (family-level)  Family references variable precision DSP blocks and high compute throughput for demanding signal processing workloads.
  • Power and supply  Core voltage supply range 820 mV to 880 mV to match multi-rail power architectures and system power planning.
  • Package and mounting  1760-BBGA (FCBGA) / supplier package 1760-FBGA (42.5 × 42.5 mm), surface-mount mounting for compact, high-density board designs.
  • Temperature and grade  Extended grade with an operating temperature range of 0°C to 100°C.
  • Compliance  RoHS compliant.

Typical Applications

  • High-speed networking and telecom  Use the large logic and memory resources plus family-level high-rate transceivers and Ethernet/PCIe hard IP to implement packet processing, backplane, and line-card functions.
  • Data center acceleration  Implement custom acceleration engines and offload functions where high logic density and wide I/O support are required.
  • Advanced signal processing  Support DSP-heavy workloads and large buffering for applications such as RF processing, modulation, and high-throughput analytics.
  • Custom SoC and system integration  Integrate complex I/O, memory controllers, and hard IP blocks to consolidate functions into a single programmable device.

Unique Advantages

  • High logic density: 2,500,000 logic elements enable implementation of very large, complex FPGA designs without partitioning across multiple devices.
  • Large on-chip memory: 204,472,320 total RAM bits reduce dependence on external memory for many buffering and state requirements.
  • Extensive I/O capability: 688 I/O pins support wide parallel interfaces and dense board-level connectivity.
  • Package optimized for high-density boards: 1760-FBGA (42.5 × 42.5 mm) surface-mount package simplifies integration into high-performance systems.
  • Designed for high-performance workloads: Family-level Hyperflex architecture and DSP/transceiver features provide a platform suited to demanding compute and bandwidth tasks.
  • Commercial extended operating range: Extended grade and 0°C to 100°C operating temperature accommodate a variety of system environments.

Why Choose 1SG250LN3F43E3XG?

The 1SG250LN3F43E3XG positions itself as a high-capacity Stratix 10 GX FPGA option for engineers needing significant logic, memory, and I/O resources in a single packaged device. Its family-level architecture and features are aimed at designs that require increased core performance, integrated high-speed interfaces, and substantial on-chip storage.

This device suits teams designing high-throughput networking equipment, data center accelerators, or complex signal-processing systems where consolidation of functions and scalable performance are priorities. The combination of device-level specifications and Stratix 10 family innovations provides a platform that supports long-term system scalability and integration.

Request a quote or submit an inquiry to our team for pricing, availability, and lead-time information on 1SG250LN3F43E3XG.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up