1SG250LN3F43E3XG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2500000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 687 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 312500 | Number of Logic Elements/Cells | 2500000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 204472320 |
Overview of 1SG250LN3F43E3XG – Stratix® 10 GX FPGA, 2,500,000 logic elements, 688 I/O, 1760-BBGA
The 1SG250LN3F43E3XG is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 1760-BBGA FCBGA package. It targets high-bandwidth, high-performance designs that require large logic capacity, extensive on-chip memory, and abundant I/O.
Part of the Stratix 10 family, this device leverages family innovations such as the Intel Hyperflex core architecture and high‑speed transceiver technology to address demanding applications in networking, data center acceleration, and advanced signal processing.
Key Features
- Core architecture Family-level Intel Hyperflex core architecture designed to deliver increased core performance and higher processing efficiency.
- Logic capacity 2,500,000 logic elements (with 312,500 reported logic clusters/ALM-equivalent) for large, complex FPGA implementations.
- On-chip memory 204,472,320 total RAM bits to support large buffering, packet processing, and state storage requirements.
- I/O and interfaces 688 I/O pins to support wide parallel interfaces and dense system connectivity.
- High-speed transceiver and IP (family-level) Stratix 10 family documentation describes heterogeneous transceiver tiles and high-rate transceiver options (family features include multi‑Gbps transceivers, hard PCI Express Gen3 x16 IP, and hard 10G/40G Ethernet IP with FEC).
- DSP and compute (family-level) Family references variable precision DSP blocks and high compute throughput for demanding signal processing workloads.
- Power and supply Core voltage supply range 820 mV to 880 mV to match multi-rail power architectures and system power planning.
- Package and mounting 1760-BBGA (FCBGA) / supplier package 1760-FBGA (42.5 × 42.5 mm), surface-mount mounting for compact, high-density board designs.
- Temperature and grade Extended grade with an operating temperature range of 0°C to 100°C.
- Compliance RoHS compliant.
Typical Applications
- High-speed networking and telecom Use the large logic and memory resources plus family-level high-rate transceivers and Ethernet/PCIe hard IP to implement packet processing, backplane, and line-card functions.
- Data center acceleration Implement custom acceleration engines and offload functions where high logic density and wide I/O support are required.
- Advanced signal processing Support DSP-heavy workloads and large buffering for applications such as RF processing, modulation, and high-throughput analytics.
- Custom SoC and system integration Integrate complex I/O, memory controllers, and hard IP blocks to consolidate functions into a single programmable device.
Unique Advantages
- High logic density: 2,500,000 logic elements enable implementation of very large, complex FPGA designs without partitioning across multiple devices.
- Large on-chip memory: 204,472,320 total RAM bits reduce dependence on external memory for many buffering and state requirements.
- Extensive I/O capability: 688 I/O pins support wide parallel interfaces and dense board-level connectivity.
- Package optimized for high-density boards: 1760-FBGA (42.5 × 42.5 mm) surface-mount package simplifies integration into high-performance systems.
- Designed for high-performance workloads: Family-level Hyperflex architecture and DSP/transceiver features provide a platform suited to demanding compute and bandwidth tasks.
- Commercial extended operating range: Extended grade and 0°C to 100°C operating temperature accommodate a variety of system environments.
Why Choose 1SG250LN3F43E3XG?
The 1SG250LN3F43E3XG positions itself as a high-capacity Stratix 10 GX FPGA option for engineers needing significant logic, memory, and I/O resources in a single packaged device. Its family-level architecture and features are aimed at designs that require increased core performance, integrated high-speed interfaces, and substantial on-chip storage.
This device suits teams designing high-throughput networking equipment, data center accelerators, or complex signal-processing systems where consolidation of functions and scalable performance are priorities. The combination of device-level specifications and Stratix 10 family innovations provides a platform that supports long-term system scalability and integration.
Request a quote or submit an inquiry to our team for pricing, availability, and lead-time information on 1SG250LN3F43E3XG.

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