1SG250HU3F50I3XG

The Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) 1SG250HU3F50I3XG is a high-density, industrial-grade programmable device built for demanding bandwidth and compute tasks. As a member of the Stratix 10 GX family, it leverages the family’s advanced architecture to provide large programmable fabric, extensive on-chip RAM, and a high pin-count I/O footprint for systems requiring substantial logic, memory, and interface integration.

This device targets applications that require high-performance programmable logic, large embedded memory, and many I/O—delivering a combination of logic capacity, fast transceiver-capable I/O, and industrial temperature range suitable for robust embedded and networking equipment.

Key Features

• Advanced Core Architecture  Built on the Stratix 10 GX family architecture with the Intel Hyperflex core technology described in the device overview, providing enhanced core performance at the family level.
• Large Logic Capacity  2,500,000 logic elements (logic cells) suitable for complex FPGA designs and large custom logic implementations.
• Abundant On‑Chip Memory  204,472,320 total RAM bits to support large buffers, lookup tables, and memory-intensive algorithms directly in the FPGA fabric.
• High I/O Count  704 user I/O pins to support dense external connectivity and multiple parallel interfaces.
• Transceiver and Hard IP Family Capabilities  Part of the Stratix 10 GX family that includes high-speed transceiver and hard-IP features in the device overview, enabling high-bandwidth chip-to-chip and system interfaces at the family level.
• Power and Supply  Core voltage supply range of 820 mV to 880 mV for the device core power domain as specified.
• Industrial Grade Temperature  Rated for operation from −40 °C to 100 °C, suitable for applications requiring industrial temperature performance.
• Package and Mounting  2397‑BBGA (FCBGA) package, supplier device package listed as 2397‑FBGA, FC (50×50), and surface mount mounting type for compact, board‑level integration.
• Compliance  RoHS compliant.

Typical Applications

• High‑Performance Networking & Data Center  Large logic capacity and family-level high-speed transceiver capabilities make this device suitable for packet processing, switching, and data-plane acceleration in networking equipment.
• Telecommunications & Backhaul  Extensive on-chip RAM and many I/Os enable protocol handling, framing, and buffering functions required in telecom line cards and backhaul systems.
• Signal Processing & Acceleration  High logic density and large embedded memory support compute- and memory-intensive DSP pipelines and hardware acceleration tasks implemented in the FPGA fabric.
• Embedded SoC and System Integration  As a Stratix 10 GX family device, it fits designs needing tightly integrated programmable logic and hard-IP interfaces for complex system integration and offload functions.

Unique Advantages

• Massive Logic Resources:  2,500,000 logic elements enable integration of large custom logic blocks and multiple concurrent hardware functions on a single device, reducing board-level complexity.
• Large On‑Chip Memory:  Over 204 million RAM bits provide capacity for deep buffering, lookup tables, and state storage without relying on external memory for many use cases.
• High Pin Count:  704 I/O pins support numerous parallel interfaces and high-density external connectivity for multi-lane or multi-protocol designs.
• Industrial Temperature Rating:  −40 °C to 100 °C operating range supports deployment in industrial environments that require extended temperature capability.
• Compact High‑Density Package:  2397‑BBGA (FCBGA) surface mount package provides a compact footprint for high-pin-count integration on modern PCBs.
• Regulatory Compliance:  RoHS compliance simplifies environmental and supply-chain requirements.

Why Choose 1SG250HU3F50I3XG?

The 1SG250HU3F50I3XG brings a combination of large programmable logic, extensive embedded memory, and a high I/O count in an industrial-temperature Stratix 10 GX FPGA package. It is positioned for designs that require substantial on-chip resources and robust operating range—helping consolidate functions, reduce external components, and support high-throughput system architectures.

Designed for engineering teams implementing complex networking, signal processing, and embedded acceleration solutions, this device offers scalable logic and memory capacity along with the connectivity needed to integrate into advanced systems while meeting industrial environmental requirements.

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