1SG250HU3F50I2VG

The 1SG250HU3F50I2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2397‑BBGA FCBGA package. It implements the Intel Hyperflex™ core architecture on Intel 14 nm tri‑gate (FinFET) technology and targets advanced applications that require high logic capacity, large on‑chip memory, and extensive I/O connectivity.

With 2,500,000 logic elements, 204,472,320 bits of embedded RAM, and a 704‑pin I/O interface, this industrial‑grade device is designed for high‑performance compute, networking, and data‑processing systems where integration density, power‑efficient core operation, and robust thermal range are important.

Key Features

• Core Architecture  Built on the Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) process as described in the Stratix® 10 family overview.
• Logic Capacity  2,500,000 logic elements to support large, complex designs and high logic utilization.
• Embedded Memory  204,472,320 total RAM bits of on‑chip SRAM for buffering, large state storage, and on‑chip data structures.
• I/O and Packaging  704 I/O pins in a 2397‑BBGA (FCBGA) package with surface‑mount mounting to support wide external connectivity and dense board integration.
• Power and Voltage  Core voltage operation specified from 770 mV to 970 mV for the device core supply.
• Operating Temperature  Industrial temperature grade with an operating range of −40 °C to 100 °C for deployment in demanding environments.
• Mounting and Compliance  Surface‑mount package; RoHS compliant.

Typical Applications

• High‑performance networking  Implement packet processing, switch fabric logic, and protocol offload using large logic capacity and abundant I/O.
• Data center acceleration  Use extensive on‑chip memory and logic for data preprocessing, custom acceleration, and streaming pipelines.
• Telecommunications and backplane systems  Integrate into systems requiring dense I/O and robust thermal margins for continuous operation.
• Advanced signal processing  Deploy DSP and custom datapath implementations that leverage high logic density and substantial embedded RAM.

Unique Advantages

• High logic density: 2,500,000 logic elements provide the headroom to implement complex algorithms and large FPGA designs without external logic.
• Large on‑chip memory: Over 204 million bits of embedded RAM reduce dependency on external memory for buffering and state storage.
• Extensive I/O integration: 704 I/O pins in a single FCBGA package simplify board routing and system connectivity for multi‑lane interfaces.
• Industrial temperature range: Rated from −40 °C to 100 °C for use in systems that require extended thermal capability.
• Low‑voltage core operation: Core voltage specified between 770 mV and 970 mV to support power‑optimized designs.
• RoHS compliant: Conforms to RoHS requirements for environmental compliance in manufacturing.

Why Choose 1SG250HU3F50I2VG?

The 1SG250HU3F50I2VG brings high logic capacity, large embedded RAM, and substantial I/O in a single Stratix® 10 GX FCBGA package suited to demanding, industrial‑grade systems. Its Hyperflex core architecture and 14 nm FinFET family heritage provide a platform engineered for high throughput and efficient operation across a wide temperature range.

This device is targeted at designers building high‑bandwidth networking, data‑processing, and compute‑intensive systems who need on‑chip resources and connectivity to minimize external components and simplify board design. The combination of logic, memory, and I/O density supports scalable designs with long‑term deployment in industrial environments.

Request a quote or contact sales to discuss availability, pricing, and integration support for the 1SG250HU3F50I2VG.