1SG250LU3F50I3XG

IC FPGA 704 I/O 2397BGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2500000 2397-BBGA, FCBGA

Quantity 760 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O704Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs312500Number of Logic Elements/Cells2500000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits204472320

Overview of 1SG250LU3F50I3XG – Stratix® 10 GX Field Programmable Gate Array (FPGA)

The 1SG250LU3F50I3XG is a Stratix® 10 GX FPGA optimized for high-performance, high-density programmable logic applications. Built on the Stratix 10 GX family architecture, it combines a large logic fabric with extensive embedded memory and high I/O density to address demanding bandwidth and compute requirements.

Targeted at industrial-grade systems, this device delivers 2,500,000 logic elements, 204,472,320 bits of on-chip RAM, and 704 I/O pins in a 2397-BBGA FCBGA package, supporting designs that require significant parallel processing, memory bandwidth, and high-speed interfacing.

Key Features

  • Core Architecture  Stratix 10 GX family innovations including the Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) technology provide the underlying family-level performance and efficiency improvements described for Stratix 10 GX devices.
  • Logic Capacity  2,500,000 logic elements (LEs) provide substantial programmable fabric for complex, parallel designs.
  • Embedded Memory  204,472,320 total RAM bits of on-chip memory support large buffering, caching, and state storage for data-intensive applications.
  • I/O and Connectivity  704 general-purpose I/O pins enable high pin-count designs and extensive external interfacing in a single device.
  • High-Speed Transceiver and IP Capabilities  Stratix 10 GX family documentation highlights high-performance transceiver and hard IP features (family-level), enabling high-bandwidth chip-to-chip and backplane interfaces when implemented in designs.
  • Power Supply  Supported core voltage range of 820 mV to 880 mV for device operation.
  • Package and Mounting  2397-BBGA, FCBGA (2397-FBGA, FC 50×50) package; surface-mount mounting type suited for PCB assembly in high-density systems.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, matching industrial application requirements.
  • Device Grade and Compliance  Industrial grade device with RoHS compliance for standard environmental requirements.

Typical Applications

  • High‑Performance Networking & Telecom  Use the device’s large logic capacity, embedded memory, and family-level high-speed transceiver capabilities to implement packet processing, line cards, and backplane interface functions.
  • Data Center Acceleration  Deploy as an acceleration fabric for compute and storage tasks that require large parallel logic resources and substantial on-chip memory.
  • Test & Measurement Systems  Apply the FPGA’s I/O density and memory to high-channel-count data acquisition, real-time processing, and instrumentation control.
  • Signal Processing & Radar  Leverage the device’s logic density and on-chip RAM for DSP pipelines and buffering in advanced radar, sonar, and communications signal-processing chains.

Unique Advantages

  • Massive Logic Resources: 2,500,000 logic elements enable implementation of very large, deeply parallel designs within a single device.
  • Large On‑Chip Memory: Over 204 million bits of RAM reduce reliance on external memory for many buffering and state-storage needs, simplifying board-level design.
  • High I/O Count: 704 I/O pins support dense external interfacing and multi-channel system designs without additional multiplexing.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a robust FCBGA package suitable for industrial environments.
  • Low-Voltage Core Operation: Narrow core supply range (820 mV–880 mV) consistent with modern low-voltage FPGA power architectures.
  • Family-Level Performance Innovations: Benefits from Stratix 10 GX family innovations (Hyperflex core, 14 nm FinFET) for enhanced performance and efficiency when used in applicable designs.

Why Choose 1SG250LU3F50I3XG?

The 1SG250LU3F50I3XG positions itself as a high-capacity, industrial-grade Stratix 10 GX FPGA suitable for systems that demand large programmable logic, significant on-chip memory, and high I/O density. Its specification set supports complex signal processing, high-bandwidth networking, and acceleration tasks where consolidating functionality into a single, robust FPGA reduces system complexity.

As part of the Stratix 10 GX family, this device offers scalability within the family-level architecture and a platform for designs that require long-term performance headroom and integration of high-density logic, memory, and connectivity features.

Request a quote or submit an inquiry for pricing and availability of the 1SG250LU3F50I3XG to move your design from evaluation to production planning.

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