1SG250LU3F50I3XG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2500000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 760 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 704 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 312500 | Number of Logic Elements/Cells | 2500000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 204472320 |
Overview of 1SG250LU3F50I3XG – Stratix® 10 GX Field Programmable Gate Array (FPGA)
The 1SG250LU3F50I3XG is a Stratix® 10 GX FPGA optimized for high-performance, high-density programmable logic applications. Built on the Stratix 10 GX family architecture, it combines a large logic fabric with extensive embedded memory and high I/O density to address demanding bandwidth and compute requirements.
Targeted at industrial-grade systems, this device delivers 2,500,000 logic elements, 204,472,320 bits of on-chip RAM, and 704 I/O pins in a 2397-BBGA FCBGA package, supporting designs that require significant parallel processing, memory bandwidth, and high-speed interfacing.
Key Features
- Core Architecture Stratix 10 GX family innovations including the Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) technology provide the underlying family-level performance and efficiency improvements described for Stratix 10 GX devices.
- Logic Capacity 2,500,000 logic elements (LEs) provide substantial programmable fabric for complex, parallel designs.
- Embedded Memory 204,472,320 total RAM bits of on-chip memory support large buffering, caching, and state storage for data-intensive applications.
- I/O and Connectivity 704 general-purpose I/O pins enable high pin-count designs and extensive external interfacing in a single device.
- High-Speed Transceiver and IP Capabilities Stratix 10 GX family documentation highlights high-performance transceiver and hard IP features (family-level), enabling high-bandwidth chip-to-chip and backplane interfaces when implemented in designs.
- Power Supply Supported core voltage range of 820 mV to 880 mV for device operation.
- Package and Mounting 2397-BBGA, FCBGA (2397-FBGA, FC 50×50) package; surface-mount mounting type suited for PCB assembly in high-density systems.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, matching industrial application requirements.
- Device Grade and Compliance Industrial grade device with RoHS compliance for standard environmental requirements.
Typical Applications
- High‑Performance Networking & Telecom Use the device’s large logic capacity, embedded memory, and family-level high-speed transceiver capabilities to implement packet processing, line cards, and backplane interface functions.
- Data Center Acceleration Deploy as an acceleration fabric for compute and storage tasks that require large parallel logic resources and substantial on-chip memory.
- Test & Measurement Systems Apply the FPGA’s I/O density and memory to high-channel-count data acquisition, real-time processing, and instrumentation control.
- Signal Processing & Radar Leverage the device’s logic density and on-chip RAM for DSP pipelines and buffering in advanced radar, sonar, and communications signal-processing chains.
Unique Advantages
- Massive Logic Resources: 2,500,000 logic elements enable implementation of very large, deeply parallel designs within a single device.
- Large On‑Chip Memory: Over 204 million bits of RAM reduce reliance on external memory for many buffering and state-storage needs, simplifying board-level design.
- High I/O Count: 704 I/O pins support dense external interfacing and multi-channel system designs without additional multiplexing.
- Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a robust FCBGA package suitable for industrial environments.
- Low-Voltage Core Operation: Narrow core supply range (820 mV–880 mV) consistent with modern low-voltage FPGA power architectures.
- Family-Level Performance Innovations: Benefits from Stratix 10 GX family innovations (Hyperflex core, 14 nm FinFET) for enhanced performance and efficiency when used in applicable designs.
Why Choose 1SG250LU3F50I3XG?
The 1SG250LU3F50I3XG positions itself as a high-capacity, industrial-grade Stratix 10 GX FPGA suitable for systems that demand large programmable logic, significant on-chip memory, and high I/O density. Its specification set supports complex signal processing, high-bandwidth networking, and acceleration tasks where consolidating functionality into a single, robust FPGA reduces system complexity.
As part of the Stratix 10 GX family, this device offers scalability within the family-level architecture and a platform for designs that require long-term performance headroom and integration of high-density logic, memory, and connectivity features.
Request a quote or submit an inquiry for pricing and availability of the 1SG250LU3F50I3XG to move your design from evaluation to production planning.

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