1SG280HH1F55E1VG

The 1SG280HH1F55E1VG is a high-density Stratix® 10 GX field programmable gate array (FPGA) IC designed for demanding bandwidth and processing applications. Built on the Stratix 10 GX family technologies, this device combines a large programmable fabric with substantial on-chip memory and high I/O density to address advanced communications, compute acceleration, and high-speed interface designs.

Key value comes from its 2,800,000 logic elements, 240,123,904 bits of internal RAM, and 1,160 I/O pins in a compact 2912-BBGA (55×55 mm) surface-mount package, together with family-level innovations in core architecture and high-speed transceivers.

Key Features

• Core & architecture  Part of the Intel Stratix 10 GX family, incorporating the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process as documented for the device family.
• Logic capacity  2,800,000 logic elements (LEs) to implement large, complex FPGA designs and dense custom logic.
• On-chip memory  240,123,904 total RAM bits for pooling internal storage across multiple functions and buffering needs.
• I/O and packaging  1,160 I/O pins in a 2912-BBGA, FCBGA package (supplier package: 2912-FBGA, FC 55×55) with surface-mount mounting for compact board integration.
• Power supply  Core supply voltage range from 770 mV to 970 mV to support optimized core-power operation.
• Operating range & grade  Extended grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance.
• High-speed transceiver and interface capabilities (family-level)  Stratix 10 GX family features include heterogeneous 3D SiP transceiver tiles and transceiver data rates cited in the device family documentation to support high-bandwidth chip-to-chip and backplane links.
• System-level IP and features (family-level)  Family documentation highlights hard IP options such as PCI Express, 10G/40G Ethernet with FEC, and hard memory controllers for high-performance system integration.

Typical Applications

• High-performance networking  Implement packet processing, switch fabric, and line-rate encryption/decryption using the device’s large logic capacity, extensive on-chip RAM, and high I/O count.
• Data center acceleration  Offload compute kernels and custom accelerators where high logic density and substantial internal memory support large, parallel workloads.
• High-speed serial and backplane systems  Deploy in systems requiring dense I/O and high-speed links, leveraging the Stratix 10 GX family’s transceiver and interface capabilities.
• Telecommunications and packet processing  Use for forwarding engines, protocol handling, and packet buffering that demand a combination of logic resources and internal RAM.

Unique Advantages

• Massive programmable capacity: 2,800,000 logic elements provide the headroom to implement large, complex designs and multiple concurrent subsystems in a single device.
• Large embedded RAM: 240,123,904 bits of internal RAM reduce dependence on external memory for buffering and on-chip data paths, simplifying board-level design.
• High I/O density in compact package: 1,160 I/Os in a 2912-BBGA (55×55) surface-mount package enables dense routing and high pin-count connectivity while conserving PCB area.
• Family-level technology innovations: Built on the Stratix 10 GX family platform with Hyperflex core architecture and 14 nm FinFET process technologies to support scalable performance and efficiency.
• Designed for system integration: Family documentation highlights hardened interface IP and high-speed transceivers to accelerate integration of PCIe, Ethernet, and memory interfaces.
• Extended-grade reliability: Extended grade specification and 0 °C to 100 °C operating range for deployment in demanding commercial and industrial equipment.

Why Choose 1SG280HH1F55E1VG?

The 1SG280HH1F55E1VG delivers a high-density FPGA solution that combines extensive logic resources, large internal RAM, and high I/O count in a compact 2912-BBGA package. As a Stratix 10 GX family device, it benefits from the family’s core architecture and system-level capabilities to address high-bandwidth, compute-intensive designs.

This device is ideal for engineering teams designing networking infrastructure, data center accelerators, and high-speed communication systems that require scalable performance, integrated memory resources, and a robust platform for implementing complex system IP and custom logic.

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