1SG250HU2F50I2LG

The 1SG250HU2F50I2LG is an Intel Stratix® 10 GX field programmable gate array (FPGA) offering 2,500,000 logic elements and 704 I/O in a high-density FCBGA package. It is built on the Stratix 10 family architecture and targets high-performance designs that require large on-chip logic capacity, substantial embedded memory, and a broad I/O complement.

As part of the Stratix 10 GX family, the device leverages family-level innovations—such as the Hyperflex core architecture and Intel 14 nm tri-gate process—to address applications demanding increased bandwidth and processing performance while operating within a low-voltage core envelope.

Key Features

• High Logic Capacity  2,500,000 logic elements provide extensive programmable fabric for complex FPGA implementations.
• Logic Array (ALMs/CLBs)  312,500 logic clusters (family CLB/ALM count provided) to structure and scale large designs.
• Embedded Memory  204,472,320 total RAM bits for large on-chip buffering, caches, and data structures.
• Rich I/O  704 user I/O pins to support wide parallel interfaces and dense system connectivity.
• Package & Mounting  2397-BBGA (FCBGA) package; supplier device package listed as 2397-FBGA, FC (50×50). Surface mount construction suitable for high-density board designs.
• Power Envelope  Core voltage supply range specified at 820 mV to 880 mV for the FPGA core.
• Operating Range  Industrial-grade temperature range of −40°C to 100°C for deployment in demanding environments.
• Stratix 10 Family Innovations  Family-level features include the Intel Hyperflex core architecture and Intel 14 nm tri-gate process aimed at improved core performance and power efficiency.
• Standards & Compliance  RoHS compliant.

Typical Applications

• Telecommunications & Networking  Use the device where high logic density and extensive I/O are required to implement packet processing, protocol acceleration, and line-rate interfaces.
• Data Center Acceleration  Deploy for compute offload and custom acceleration engines that benefit from large on-chip memory and substantial programmable fabric.
• High‑Speed Test & Measurement  Apply the FPGA for capture, preprocessing, and real-time analysis tasks that need many I/O channels and large RAM capacity.
• Broadcast & Video Infrastructure  Use the device to implement multi-channel video processing pipelines and format conversion leveraging the device’s memory and logic resources.

Unique Advantages

• Massive programmable capacity: 2,500,000 logic elements enable large, complex designs without partitioning across multiple devices.
• Substantial on‑chip memory: Over 204 million bits of RAM reduce reliance on external memory for many buffering and cache needs.
• Wide I/O complement: 704 I/Os support dense front-panel interfaces and wide parallel buses for system integration.
• Industrial temperature capability: −40°C to 100°C rating supports deployment in thermally challenging or industrial environments.
• Low-voltage core operation: Core supply range of 820 mV–880 mV supports low-power system design considerations.
• High-density package: 2397‑ball FCBGA packaging delivers a compact footprint for board-level density and integration.

Why Choose 1SG250HU2F50I2LG?

The 1SG250HU2F50I2LG positions itself as a high-capacity Stratix 10 GX FPGA optimized for designs that require a large logic fabric, extensive embedded memory, and a broad I/O set within an industrial temperature envelope. Its family-level architecture and process attributes provide a foundation for applications that prioritize throughput and on-chip resource density.

This device is suitable for engineering teams developing advanced networking, data center acceleration, and high-speed instrumentation solutions that need scalable FPGA resources and the reliability of an industrial-grade component.

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