1SG280HN1F43E1VGS3
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 382 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280HN1F43E1VGS3 – Stratix® 10 GX FPGA, 2,800,000 logic elements, 688 I/Os, 1760‑BBGA
The 1SG280HN1F43E1VGS3 is an Intel Stratix® 10 GX field programmable gate array (FPGA) packaged in a 1760‑BBGA (FCBGA) package. It pairs very high logic density with extensive I/O capability to address demanding, bandwidth‑intensive applications.
Built on the Stratix 10 architecture family, the device targets high‑performance networking, data center acceleration, telecommunications and compute systems that require large FPGA fabric, significant on‑chip memory, and a broad complement of high‑speed interfaces.
Key Features
- Logic Capacity — 2,800,000 logic elements provide large programmable fabric for complex RTL implementations and large hardware accelerators.
- On‑Chip Memory — 240,123,904 total RAM bits of embedded memory to support large buffering, lookup tables, and state storage for high‑throughput designs.
- I/O Density — 688 I/Os for flexible, high‑pin‑count interfacing to external devices, memory, and high‑speed links.
- Package & Mounting — 1760‑BBGA (1760‑FBGA, 42.5 × 42.5 mm) surface‑mount package for high‑density board integration.
- Voltage and Power — Core voltage supply range 770 mV to 970 mV to match system power architecture requirements.
- Operating Range — Extended grade operation from 0 °C to 100 °C to suit a broad range of commercial and enterprise environments.
- Series‑level Innovations — Stratix 10 family features such as the Intel Hyperflex™ core architecture and 14 nm tri‑gate (FinFET) technology, providing the architectural foundation for improved core performance and energy efficiency.
- System and I/O IP (series) — Series documentation highlights hardened IP options such as PCI Express Gen3 x16, high‑performance transceivers and 10G Ethernet hard IP, enabling integration of standard protocols into high‑bandwidth systems.
- Compliance — RoHS compliant to support modern environmental and manufacturing requirements.
Typical Applications
- High‑Speed Networking and Switching — Implement packet processing, switching fabric and protocol offload with abundant logic, memory and high I/O count.
- Data Center Acceleration — Deploy custom accelerators and data‑path engines where large logic capacity and embedded memory drive throughput and latency objectives.
- Telecommunications and Optical Transport — Support channel aggregation, forward error correction and transceiver interfacing common in telecom backplanes and transport systems.
- High‑Performance DSP and Signal Processing — Use the device’s large fabric and memory resources for wideband signal processing, filtering and algorithmic acceleration.
Unique Advantages
- Massive Logic Density: 2.8M logic elements enable implementation of large, complex designs without partitioning across multiple devices.
- Substantial On‑Chip Memory: Over 240 million bits of RAM reduce external memory dependence and improve data locality for high‑throughput tasks.
- High I/O Count: 688 configurable I/Os simplify system integration and support wide parallel interfaces or numerous serial links.
- Series‑level Performance Architecture: Intel Hyperflex core architecture and FinFET process technology (Stratix 10 series) provide the architectural basis for improved core performance and energy efficiency.
- Package for Dense Designs: 1760‑FBGA package (42.5 × 42.5 mm) supports high pin count and thermal distribution for complex board layouts.
- Enterprise Operating Range: Extended grade operation (0 °C to 100 °C) aligns with commercial and many enterprise deployment environments.
Why Choose 1SG280HN1F43E1VGS3?
This Stratix® 10 GX device combines very high logic capacity, large embedded memory and broad I/O to serve as a central programmable resource in bandwidth‑heavy, computation‑intensive systems. It is well suited for engineers building network infrastructure, data center accelerators, and advanced signal processing platforms that require scalable FPGA fabric and robust system IP.
Choosing this device provides designers with the density and integration needed to consolidate functions, reduce board complexity, and implement large hardware accelerators while leveraging the Stratix 10 series architecture and ecosystem for long‑term design scalability.
Request a quote or submit an inquiry to receive pricing, lead‑time and availability details for the 1SG280HN1F43E1VGS3. Our team can assist with technical and procurement questions to help move your design forward.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018