1SG280HN3F43E1VGS3

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA

Quantity 1,041 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SG280HN3F43E1VGS3 – Stratix® 10 GX FPGA, 2,800,000 logic elements, 688 I/O, 1760-BBGA

The 1SG280HN3F43E1VGS3 is an Intel Stratix® 10 GX Field Programmable Gate Array delivered in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) package. Designed for high-performance, high-bandwidth applications, this device integrates a large logic fabric with extensive on-chip memory and a high I/O count to support demanding digital signal processing, networking, and compute tasks.

Built on the Stratix® 10 family architecture, the device leverages the family’s core innovations—such as the Hyperflex core architecture and advanced transceiver and hard-IP options—to provide performance and integration for data center, communications, and advanced embedded systems that require high throughput and flexible implementable logic.

Key Features

  • Core Architecture  Part of the Stratix® 10 GX family with Hyperflex core architecture and 14 nm FinFET technology as described for the family.
  • Logic Capacity  2,800,000 logic elements for large-scale logic designs and complex programmable implementations.
  • On-chip Memory  240,123,904 total RAM bits to support deep buffering, large lookup tables, and memory-intensive algorithms.
  • I/O and Transceivers  688 general-purpose I/O pins and family-level support for heterogeneous 3D SiP transceiver tiles with up to 96 full-duplex transceiver channels and transceiver data rates up to 28.3 Gbps (family capability).
  • Hard IP and DSP  Stratix® 10 family includes hard PCI Express Gen3 x16 IP, 10G/40G Ethernet FEC in transceivers, and variable-precision DSP blocks capability (family-level features).
  • Package & Mounting  1760-BBGA (FCBGA) in a 1760-FBGA supplier package; surface-mount device optimized for board-level integration.
  • Power Supply  Core voltage supply range: 770 mV to 970 mV, supporting low-voltage core operation.
  • Temperature Grade  Extended grade operation from 0 °C to 100 °C for applications requiring an extended commercial temperature range.
  • Compliance  RoHS compliant.

Typical Applications

  • High-Speed Networking & Telecom  Use the device’s high I/O count, multi-gigabit transceiver capability, and hard Ethernet/forward error-correction IP (family-level) for switches, routers, and line cards.
  • Data Center Accelerators  Leverage the large logic capacity and abundant on-chip RAM for packet processing, custom acceleration, and preprocessing workloads.
  • High-Performance Signal Processing  Deploy variable-precision DSP blocks and extensive RAM for wideband signal processing, modulation/demodulation, and software-defined radio functions (family-level features).
  • Embedded Compute & SoC Integration  Integrate programmable logic with family variants that include embedded processor systems for heterogeneous compute and control tasks.

Unique Advantages

  • Large programmable fabric: 2.8 million logic elements provide the capacity to implement complex, large-scale datapaths and control logic on a single device.
  • High on-chip memory: 240,123,904 total RAM bits reduce external memory dependence and support deep buffering and large associative structures.
  • Extensive I/O and package options: 688 I/O pins combined with a 1760-BBGA package allow dense board-level integration and routing flexibility.
  • Family-level transceiver and IP capability: The Stratix® 10 family delivers high-speed transceiver support and hard-IP building blocks—enabling designs that require multi-gigabit links and standardized interfaces (family-level).
  • Optimized power envelope: Core supply range of 770 mV–970 mV supports efficient core operation and power planning at board level.
  • Extended temperature operation: Rated 0 °C to 100 °C for deployments requiring extended commercial temperature range support.

Why Choose 1SG280HN3F43E1VGS3?

The 1SG280HN3F43E1VGS3 combines a very large logic capacity with significant on-chip RAM and a high I/O count in a compact 1760-BBGA package, positioning it for high-bandwidth, compute-intensive applications. Its voltage and temperature specifications, together with Stratix® 10 family architecture characteristics, make it suitable for designs that need scalable programmable logic, substantial local memory, and robust board-level integration.

This device is well suited to engineering teams building advanced networking, accelerator, and signal processing systems who need a high-capacity FPGA platform backed by the Stratix® 10 family feature set and ecosystem.

Request a quote or submit an inquiry to get pricing, availability, and support details for the 1SG280HN3F43E1VGS3. Our team can help with lead times and volume requirements.

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