1SG280HN3F43E2LGS3

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA

Quantity 709 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SG280HN3F43E2LGS3 – Stratix® 10 GX FPGA 1760‑BBGA

The 1SG280HN3F43E2LGS3 is a Stratix® 10 GX field programmable gate array (FPGA) in a 1760‑BBGA (FCBGA) package. It is built on the Stratix 10 family architecture and leverages the family’s Hyperflex core and 14 nm tri‑gate (FinFET) technology to deliver high logic density and on‑chip memory for demanding, high‑performance applications.

Designed for applications that require substantial processing resources, high I/O counts, and significant on‑chip RAM, this device delivers 2,800,000 logic elements, 240,123,904 total RAM bits, and 688 I/O pins in a compact 42.5 × 42.5 mm package while operating over an extended temperature range.

Key Features

  • Logic Capacity  2,800,000 logic elements (LEs) provide the programmable fabric needed for large, complex designs and custom hardware acceleration.
  • On‑Chip Memory  240,123,904 total RAM bits for buffering, large lookup tables, and data‑intensive functions without immediate external memory dependence.
  • I/O and Package  688 programmable I/O pins in a 1760‑BBGA (1760‑FBGA, 42.5 × 42.5 mm) surface‑mount package for dense connectivity and board‑level integration.
  • Power and Supply  Core voltage range 820 mV to 880 mV, enabling operation within the Stratix 10 core supply window.
  • Thermal and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C for commercial and extended‑temperature deployments.
  • Family Innovations  Built on Stratix 10 GX family technologies such as the Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) process, which are reflected in the device’s architecture and performance characteristics.
  • Standards and Compliance  RoHS compliant to support modern manufacturing and regulatory requirements.

Typical Applications

  • Data Center Acceleration  Large logic capacity and significant on‑chip RAM make this FPGA suitable for custom acceleration tasks and compute offload in data center hardware.
  • High‑Bandwidth Networking  High I/O count and Stratix 10 family transceiver and Ethernet hard IP capabilities (family features) support network switching, packet processing, and line card implementations.
  • Signal Processing and DSP  Extensive logic resources and large internal memory enable complex DSP algorithms, high‑throughput data pipelines, and protocol processing.
  • Custom SoC and Prototyping  The device’s density and family architecture make it suitable for system prototyping and development of custom SoC implementations within the Stratix 10 ecosystem.

Unique Advantages

  • High Logic Density: 2.8 million logic elements provide capacity for complex, high‑parallelism designs and hardware acceleration without immediate external logic expansion.
  • Substantial On‑Chip Memory: 240,123,904 RAM bits reduce reliance on external memory for buffers and intermediate data, simplifying board design and lowering memory latency.
  • Extensive I/O in a Compact Package: 688 I/Os in a 1760‑BBGA (42.5 × 42.5 mm) package deliver dense connectivity for multi‑lane interfaces and rich peripheral integration while minimizing board footprint.
  • Extended‑Temperature Operation: 0 °C to 100 °C operating range and extended grade classification support a wider range of deployment environments compared to standard commercial parts.
  • Family‑Level Architectural Benefits: Integration within the Stratix 10 GX family brings Hyperflex core architecture and 14 nm FinFET process advantages to designs leveraging this device.
  • Regulatory Compatibility: RoHS compliance facilitates use in modern manufacturing flows and helps meet environmental requirements.

Why Choose 1SG280HN3F43E2LGS3?

The 1SG280HN3F43E2LGS3 positions itself as a high‑density Stratix 10 GX FPGA option for engineers who need large programmable capacity, significant on‑chip RAM, and a high I/O complement in a compact FCBGA package. Its specs make it well suited to compute‑heavy, bandwidth‑sensitive designs that benefit from Stratix 10 family architecture innovations.

For teams developing data center accelerators, high‑bandwidth networking equipment, or advanced signal processing systems, this device offers a scalable option within the Stratix 10 GX portfolio—providing the logic, memory, and I/O resources necessary for complex, performance‑oriented FPGA implementations.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for the 1SG280HN3F43E2LGS3.

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