1SG280HN3F43E3VGAS

The 1SG280HN3F43E3VGAS is an Intel Stratix® 10 GX FPGA offering high logic capacity and on-chip memory in a 1760-ball FCBGA package. It is built around the Intel Hyperflex™ core architecture and Intel 14 nm tri‑gate (FinFET) process, targeting advanced, high‑bandwidth and high‑performance applications that require substantial programmable fabric and high I/O counts.

This device combines large logic and RAM resources with a wide I/O complement and low-voltage core operation, making it suitable for designs that demand dense programmable logic, large embedded memory, and extensive connectivity.

Key Features

• Core architecture  Intel Hyperflex™ core architecture delivering improved core performance versus previous generation devices.
• Process technology  Intel 14 nm tri‑gate (FinFET) process for improved power/performance characteristics.
• Logic capacity  Approximately 2,800,000 logic elements for large-scale programmable designs.
• On‑chip memory  Total RAM: 240,123,904 bits and family M20K internal SRAM memory blocks to support large buffering and lookup requirements.
• I/O and package  688 I/O pins in a 1760‑BBGA (1760‑FBGA 42.5 × 42.5 mm) FCBGA package for high-density board routing and system interfacing.
• Power  Core voltage supply range of 770 mV to 970 mV to match system power planning requirements.
• Thermal and grade  Extended grade with an operating temperature range of 0 °C to 100 °C for a wide set of commercial/industrial environments.
• High‑speed transceiver family features  Stratix 10 GX family supports high-speed transceiver capabilities (family-level data includes multi‑Gbps transceiver features), enabling high-bandwidth serial interfaces and backplane links.
• Compliance  RoHS compliant.

Typical Applications

• High‑performance networking  Large programmable fabric and high I/O count enable packet processing, switching, and line cards that require significant logic and memory resources.
• Data center acceleration  Substantial logic elements and large embedded RAM support hardware acceleration tasks and custom compute kernels.
• High‑speed serial links and backplane interfaces  Family transceiver capabilities and the device’s I/O complement suit high‑bandwidth interconnects and board‑to‑board links.
• Complex protocol and interface bridging  Ample logic and memory make the device well suited for bridging, protocol conversion, and system glue logic in complex systems.

Unique Advantages

• High logic density:  Approximately 2.8 million logic elements provide capacity for large, consolidated designs and IP integration.
• Large embedded memory:  240,123,904 bits of on‑chip RAM reduce external memory dependence for buffering and LUT‑based functions.
• Extensive I/O in a compact package:  688 I/Os in a 1760‑FBGA (42.5 × 42.5 mm) package provide extensive connectivity while maintaining a compact footprint.
• Low‑voltage core operation:  770 mV–970 mV supply range supports power budgeting for high-density FPGA implementations.
• Family performance innovations:  Hyperflex architecture and 14 nm FinFET process deliver improved core performance and power efficiency for demanding applications.
• Extended operating range:  0 °C to 100 °C operating temperature and Extended grade allow deployment across a range of commercial and industrial environments.

Why Choose 1SG280HN3F43E3VGAS?

The 1SG280HN3F43E3VGAS positions itself as a high‑capacity Stratix 10 GX FPGA offering large programmable fabric, substantial on‑chip memory, and a high I/O count in a 1760‑ball FCBGA package. Its Hyperflex architecture and 14 nm FinFET design provide a strong balance of performance and power for advanced, bandwidth‑intensive designs.

This device is suited for teams building complex, high‑performance systems that require scalable logic resources, extensive memory for buffering and state storage, and robust connectivity options. Its feature set and operating characteristics support long‑term design scalability and integration within established Intel Stratix 10 design flows.

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