1SG280HN3F43E3XG

The 1SG280HN3F43E3XG is an Intel Stratix® 10 GX field programmable gate array in a 1760-BBGA (FCBGA) package, designed for high‑density programmable logic and high‑bandwidth I/O applications. It combines a large logic capacity with extensive on‑chip memory and I/O to support advanced networking, compute acceleration, and communications designs.

Based on the Stratix 10 family architecture, the device leverages the Intel Hyperflex core architecture and family-level innovations to deliver increased core performance and efficiency for demanding system designs.

Key Features

• Programmable Logic Capacity — 2,800,000 logic elements (logic cells) for high-density implemention of complex logic, state machines, and custom accelerators.
• Integrated On‑Chip Memory — 240,123,904 total RAM bits to support large buffers, packet queues, and data buffering without immediate dependence on external memory.
• High I/O Count — 688 I/O pins to accommodate wide external interfaces, multi-channel transceivers, and dense peripheral connectivity.
• Power Supply Range — Core voltage supply range of 820 mV to 880 mV, enabling specified core power-domain operation.
• Package and Mounting — 1760‑BBGA, FCBGA package with supplier device package dimensions 1760‑FBGA (42.5 × 42.5 mm); surface mount device suitable for standard PCB assembly.
• Operating Range and Grade — Extended grade with an operating temperature range of 0°C to 100°C for elevated-temperature commercial/extended deployments.
• RoHS Compliant — Meets RoHS environmental requirements.
• Family-Level Architecture — Part of the Stratix 10 GX family, which includes the Intel Hyperflex core architecture and other innovations documented for the Stratix 10 family.

Typical Applications

• High‑Performance Networking — Implement packet processing, protocol offload, and switching functions that require high logic density and plentiful I/O.
• Data Center Acceleration — Deploy custom compute kernels and data-path acceleration where large on‑chip memory and dense logic reduce external memory traffic.
• Telecommunications & Optical Transport — Support multi‑lane interfaces and complex frame processing using the device’s high I/O count and large logic resources.
• Compute & Signal Processing — Realize large, parallel DSP and fixed‑function pipelines using abundant logic and memory resources for throughput‑oriented tasks.

Unique Advantages

• Large Logic Footprint: 2.8 million logic elements provide the capacity to implement substantial custom hardware functions and multiple concurrent accelerators.
• Substantial On‑Chip Memory: Over 240 million RAM bits reduce dependence on external memory for buffering and state storage, simplifying board-level memory design.
• Extensive I/O Portfolio: 688 I/Os enable wide data buses, numerous peripheral interfaces, and dense front‑panel or backplane connections.
• Compact, High‑Pin Package: 1760‑BBGA (42.5 × 42.5 mm) balances high pin count with a package footprint compatible with mainstream PCB manufacturing and surface‑mount assembly.
• Controlled Power Domain: Defined core voltage range (820 mV–880 mV) supports predictable power budgeting and supply design for the FPGA core.
• Extended‑Grade Thermal Range: Rated for 0°C to 100°C operation to support applications that require extended ambient temperature tolerance.

Why Choose 1SG280HN3F43E3XG?

The 1SG280HN3F43E3XG positions itself as a high‑density Stratix 10 GX FPGA option for designers who need substantial programmable logic, large on‑chip memory, and a high count of I/Os in a single device. Its combination of logic capacity, memory resources, and package pinout makes it suitable for systems that demand complex data‑plane processing, protocol handling, or custom acceleration.

Choosing this device offers scalability within the Stratix 10 family and access to family‑level architectural innovations, enabling engineering teams to target high‑performance, high‑bandwidth designs while leveraging Intel’s device documentation and ecosystem for implementation and deployment.

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