1SG280HN3F43I2VG

The 1SG280HN3F43I2VG is an Intel Stratix® 10 GX family FPGA delivering very high logic density and large on-chip RAM for demanding embedded and communications applications. It implements the Stratix 10 GX architecture and benefits from the family-level innovations described in the Stratix 10 GX/SX device overview.

With 2,800,000 logic elements, 240,123,904 bits of on-chip RAM and 688 I/O pins in a 1760-BBGA FCBGA package, this device targets high-bandwidth, high-density designs that require industrial temperature range operation and compact surface-mount packaging.

Key Features

• Core Logic — 2,800,000 logic elements provide high-density programmable fabric for complex logic, control and acceleration functions.
• On-chip Memory — 240,123,904 total RAM bits for large buffering, state storage and memory-intensive algorithms.
• I/O Capacity — 688 user I/O pins to support wide external connectivity and parallel interfaces.
• Family-Level Architecture — Built on the Stratix 10 GX family which includes Intel Hyperflex core architecture and other Stratix 10 innovations described in the device overview.
• Power Supply — Core voltage range from 770 mV to 970 mV to match system power-rail requirements.
• Package and Mounting — 1760-BBGA FCBGA (supplier package 1760-FBGA, 42.5 × 42.5 mm) in a surface-mount form factor for dense board integration.
• Industrial Temperature Range — Specified for operation from −40 °C to 100 °C, suitable for industrial environments.
• RoHS Compliant — Meets RoHS requirements for environmental compliance.

Typical Applications

• High-performance networking and telecom — Leverage high logic density and large on-chip RAM to implement packet processing, custom protocol engines and line-rate functions.
• Data-center acceleration — Use the large logic and memory resources for application-specific accelerators, offload engines and custom compute kernels.
• Signal processing and communications — Support demanding DSP, buffering and interface logic where significant on-chip RAM and I/O are required.

Unique Advantages

• Extremely high logic density: 2.8 million logic elements enable consolidation of complex functions into a single device, reducing board-level BOM and interconnect complexity.
• Substantial on-chip memory: 240,123,904 bits of RAM support large buffers and stateful processing without external memory dependencies.
• Broad I/O count: 688 I/O pins allow flexible external interface options and high parallel throughput for system integration.
• Industrial robustness: Rated for −40 °C to 100 °C operation, enabling deployment in industrial environments with extended temperature needs.
• Compact, manufacturable package: 1760-BBGA FCBGA (42.5 × 42.5 mm) surface-mount package balances density and assembly compatibility for production designs.
• Defined core voltage window: 770 mV to 970 mV supply range provides clear power-rail requirements for system planning and thermal design.

Why Choose 1SG280HN3F43I2VG?

1SG280HN3F43I2VG positions itself as a high-density Stratix 10 GX FPGA option for designs that demand large programmable fabric, abundant on-chip RAM and extensive I/O in a production-ready surface-mount package. Its industrial temperature rating and RoHS compliance make it suitable for deployment in robust embedded and communications systems.

For teams designing high-bandwidth, computation-heavy or memory-intensive systems, this FPGA delivers the capacity and integration to consolidate functions, reduce system complexity and support scalable designs that align with the Stratix 10 family feature set.

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