1SG280HU1F50E1VGS3

The 1SG280HU1F50E1VGS3 is an Intel Stratix® 10 GX field programmable gate array provided in a 2397-ball BGA (FCBGA) package. It implements the Stratix 10 GX family architecture and targets high-performance, high-density FPGA applications that require large logic capacity, abundant on-chip memory, and extensive I/O.

With 2,800,000 logic elements, 240,123,904 bits of on-chip RAM and 704 I/O pins, this surface-mount, extended-grade device is suited for demanding compute, networking, and signal-processing roles where integration and scalability matter.

Key Features

• Logic Capacity — 2,800,000 logic elements (cells) for implementing large, complex digital designs.
• On-Chip Memory — 240,123,904 total RAM bits to support large buffering, LUT-based storage, and data-path requirements.
• I/O Density — 704 I/O pins to enable high-channel count interfaces and dense board-level connectivity.
• Package & Mounting — 2397-BBGA (FCBGA) supplier device package 2397-FBGA, FC (50×50); surface-mount mounting for standard PCB assembly.
• Power Supply — Core voltage range 770 mV to 970 mV specified for device operation.
• Operating Range & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C.
• Standards & Compliance — RoHS compliant for regulatory environmental requirements.
• Family Innovations (Stratix 10) — Family-level architecture includes Intel Hyperflex core architecture and Intel 14 nm tri-gate process, delivering the performance and efficiency attributes described in the Stratix 10 GX/SX overview.

Typical Applications

• Networking & Telecom — High-density I/O and substantial on-chip memory support packet processing, line cards, and backplane interface applications.
• Data Center Acceleration — Large logic and RAM resources enable hardware acceleration and custom compute offloads for server and appliance designs.
• High-Bandwidth Signal Processing — Abundant logic elements and block RAM capacity suit multi-channel DSP and real-time processing pipelines.
• Embedded SoC & System Integration — Stratix 10 family features described in the device overview position this FPGA for integrated SoC-style designs that combine programmable logic with hardened subsystems.

Unique Advantages

• Massive Logic Integration: 2.8 million logic elements allow consolidation of complex functions onto a single device, reducing board-level component count.
• Large On-Chip Memory: 240 Mb+ of RAM bits provide substantial buffering and state storage close to logic for lower-latency designs.
• High I/O Count: 704 I/O pins enable direct interfacing to multiple parallel buses, SerDes lanes, and external devices without extensive external multiplexing.
• Package and Assembly Friendly: 2397-ball FCBGA package and surface-mount compatibility support conventional PCB assembly and thermal planning.
• Controlled Power Envelope: Defined core voltage range (770–970 mV) supports predictable power design and supply sequencing.
• Extended-Grade Reliability: Operation across 0 °C to 100 °C with RoHS compliance supports deployment in a range of commercial and extended-environment systems.

Why Choose 1SG280HU1F50E1VGS3?

The 1SG280HU1F50E1VGS3 combines high-density logic, extensive on-chip memory, and a large I/O complement in a single Stratix 10 GX package, enabling integration of complex, high-throughput functions into one FPGA. Its family-level architecture and manufacturing process deliver the performance and efficiency characteristics documented for Stratix 10 GX devices, while the extended-grade operating range and RoHS compliance support deployment in demanding commercial and extended-environment designs.

This device is well suited to engineering teams building large-scale FPGA systems for networking, data center acceleration, signal processing, and embedded system integration who require scalable logic, memory capacity, and I/O bandwidth in a production-ready package.

Request a quote or submit an inquiry to evaluate how the 1SG280HU1F50E1VGS3 can meet your project requirements and supply chain needs.