1SG280HU1F50E2LG

The 1SG280HU1F50E2LG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2397-BBGA FCBGA package. It leverages the Stratix 10 family architecture to deliver high logic capacity and extensive on-chip memory for designs requiring substantial programmable fabric and high I/O density.

Designed for high-bandwidth, compute-intensive applications, this device combines the Stratix 10 family innovations with 2,800,000 logic elements, 240,123,904 total RAM bits, and 704 I/O to support advanced networking, acceleration, and communications use cases while operating within a low-voltage core range.

Key Features

• Core Architecture Built on the Intel Stratix 10 GX family architecture with Intel Hyperflex® core innovations described in the device overview, providing enhanced core performance for complex FPGA designs.
• Logic Capacity 2,800,000 logic elements to implement large-scale programmable logic, custom datapaths, and complex control logic.
• On‑Chip Memory 240,123,904 total RAM bits of embedded memory for buffering, packet processing, and large on-chip datasets.
• High I/O Count 704 I/O pins to support dense external interfacing and multi-protocol connectivity.
• Package and Mounting 2397-BBGA, FCBGA (supplier device package 2397-FBGA, FC 50x50) in a surface-mount format for high-density board integration.
• Power Core supply range from 820 mV to 880 mV, enabling integration into low-voltage power architectures.
• Operating Temperature and Grade Extended grade with an operating temperature range of 0 °C to 100 °C, suitable for extended-temperature commercial applications.
• Standards and Compliance RoHS compliant to meet common environmental and regulatory requirements.

Typical Applications

• High‑Performance Networking — Implement packet processing, switching, and high‑speed protocol handling using the device’s large logic capacity and high I/O count.
• Data Center Acceleration — Offload compute‑intensive kernels and custom accelerators where large on‑chip memory and abundant logic elements enable low‑latency processing.
• Telecommunications Equipment — Support high-throughput signal processing, framing, and interface aggregation with dense I/O and sizable embedded RAM.
• Advanced Signal Processing — Deploy complex DSP pipelines and buffering for test equipment and instrumentation leveraging the large logic and memory resources.

Unique Advantages

• Large Programmable Fabric: 2.8 million logic elements provide headroom for complex system implementations and multi-function designs without partitioning across multiple devices.
• Substantial On‑Chip Memory: 240,123,904 RAM bits reduce external memory dependence for buffering and high-throughput data paths, simplifying PCB complexity.
• High Pin Count for Dense I/O: 704 I/O pins support multiple high‑speed interfaces and parallel connections, enabling flexible system partitioning.
• Compact, High‑Density Packaging: 2397-BBGA FCBGA surface-mount package enables integration into space-constrained boards while maintaining signal density.
• Low‑Voltage Core Operation: 820–880 mV supply window supports efficient power architectures and tight power budgeting in advanced systems.
• Extended‑Grade Thermal Range: Rated 0 °C to 100 °C to support extended commercial environments and maintain device reliability in warmer operating conditions.

Why Choose 1SG280HU1F50E2LG?

The 1SG280HU1F50E2LG positions itself as a high-capacity Stratix 10 GX FPGA option for engineers needing significant logic density, large embedded memory, and a high I/O count in a compact FCBGA package. Its extended-grade temperature range and low-voltage core specification make it suitable for advanced communications, acceleration, and signal-processing applications where integration and performance are priorities.

Choosing this Stratix 10 GX device provides a scalable, high‑performance programmable fabric that aligns with the family-level innovations documented in the device overview, enabling designers to implement complex functions on a single FPGA while benefiting from Intel’s established device ecosystem and documentation.

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