1SG280HU1F50E2VGAS

IC FPGA 704 I/O 2397BGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2800000 2397-BBGA, FCBGA

Quantity 734 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O704Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SG280HU1F50E2VGAS – Stratix® 10 GX Field Programmable Gate Array (FPGA)

The 1SG280HU1F50E2VGAS is an Intel Stratix® 10 GX FPGA in a 2397-BBGA (FCBGA) package designed for high-density, high-bandwidth system designs. It integrates the Stratix 10 family innovations, including the Intel Hyperflex™ core architecture and heterogeneous transceiver technology, and targets applications that require large programmable fabric, substantial on-chip RAM, and extensive I/O resources.

With 2,800,000 logic elements and 240,123,904 bits of on-chip RAM, this device is tailored for advanced communications, data-center, and compute-accelerator roles where throughput, integration, and flexible I/O are primary concerns.

Key Features

  • Core Architecture  Built on the Intel Stratix 10 family with the Intel Hyperflex™ core architecture, delivering increased core performance compared to previous-generation high-performance FPGAs as described in the Stratix 10 device overview.
  • Logic Density  Approximately 2,800,000 logic elements, enabling very large-scale programmable designs and complex logic implementations.
  • On‑Chip Memory  240,123,904 total RAM bits to support large buffering, caching, and shared memory use cases within the FPGA fabric.
  • I/O and Connectivity  704 I/O pins provide broad external interface capability; Stratix 10 family transceiver technology (described in the device overview) supports high-speed serial links and advanced protocol IP.
  • Package and Mounting  2397-BBGA (FCBGA) supplier device package (2397-FBGA, FC 50×50) with surface-mount mounting type for compact board implementations.
  • Power and Supply  Core voltage supply range specified at 770 mV to 970 mV to match high-performance Stratix 10 power domains.
  • Operating Range  Extended grade with an operating temperature range of 0 °C to 100 °C suitable for elevated-temperature applications that fall within this range.
  • Family-Level IP and Features  Stratix 10 family documentation highlights hard IP options such as PCI Express Gen3, high-speed Ethernet and FEC, DDR4 memory controllers, and variable-precision DSP blocks—capabilities available within the Stratix 10 device family.
  • Regulatory  RoHS compliant.

Typical Applications

  • High‑speed networking and switching  Use the device where high-bandwidth serial links and hard 10G/40G Ethernet IP (as provided by the Stratix 10 family) are required for backplane and module connectivity.
  • Data‑center acceleration  Leverage the large logic element count and on‑chip RAM for custom packet processing, protocol offload, or hardware-accelerated compute tasks.
  • Telecommunications infrastructure  Deploy in systems needing dense programmable fabric and advanced transceiver capabilities for line cards, aggregation, or transport equipment.
  • High‑performance DSP and signal processing  Implement intensive DSP workloads using Stratix 10 family variable-precision DSP resources and extensive on-chip memory.

Unique Advantages

  • High programmable density: 2,800,000 logic elements enable large, complex designs without immediate need for multiple devices.
  • Substantial on‑chip memory: 240,123,904 bits of RAM reduce dependence on external memory for many buffering and caching tasks.
  • Extensive external connectivity: 704 I/O pins provide flexible interfacing options for dense system integration.
  • Family-level advanced IP: Access to Stratix 10 GX/SX family features such as high-speed transceivers, PCIe, and DSP blocks simplifies implementation of common high-performance subsystems.
  • Robust packaging for dense boards: 2397-BBGA (FCBGA) in a surface-mount format supports compact, high‑component‑density PCB designs.
  • Controlled power domain: Core supply specified between 770 mV and 970 mV allows predictable power planning for high-performance cores.

Why Choose 1SG280HU1F50E2VGAS?

The 1SG280HU1F50E2VGAS delivers the capabilities of the Stratix 10 GX family in a high-density FCBGA package, combining multi-million logic-element capacity with large on-chip RAM and broad I/O. It is positioned for engineers building high-throughput, compute- and bandwidth‑intensive systems that benefit from Stratix 10 family architectures and device‑level features.

For designs that require scalable programmable fabric, substantial embedded memory, and advanced I/O/transceiver resources within an extended operating-temperature range, this device offers a concrete platform that aligns with the Stratix 10 GX device overview and specifications provided in the product documentation.

Request a quote or submit an inquiry to get pricing and availability for the 1SG280HU1F50E2VGAS and discuss how it fits your next high-performance FPGA design.

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