1SG280HU1F50I1VGAS

IC FPGA 704 I/O 2397BGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2800000 2397-BBGA, FCBGA

Quantity 1,641 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O704Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SG280HU1F50I1VGAS – Stratix® 10 GX FPGA, 2,800,000 logic elements, 704 I/O, 2397-BBGA (FCBGA)

The 1SG280HU1F50I1VGAS is an Intel Stratix 10 GX field programmable gate array supplied in a 2397-BBGA (FCBGA) package and graded for industrial use. It combines very high logic density with large on-chip RAM and a high I/O count to address demanding, high-bandwidth digital designs.

As part of the Stratix 10 GX family, this device leverages Intel Hyperflex core architecture and advanced 14 nm tri-gate (FinFET) technology to deliver high-performance FPGA fabric suitable for networking, communications, data center, and advanced embedded applications.

Key Features

  • Core & Architecture  Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology as foundational innovations for the Stratix 10 family.
  • Logic Capacity  2,800,000 logic elements for implementing large-scale logic, control, and custom processing pipelines.
  • On‑Chip Memory  240,123,904 total RAM bits to support large buffers, packet queues, and intermediate data storage on chip.
  • I/O & Package  704 I/O pins in a surface-mount 2397-BBGA (FCBGA) package; supplier device package listed as 2397-FBGA, FC (50×50).
  • Power & Supply  Core voltage supply range 770 mV to 970 mV to match system power domains and support power-optimized designs.
  • Temperature & Grade  Industrial grade device rated for operation from −40°C to 100°C.
  • Mounting & Compliance  Surface-mount package construction and RoHS compliance for modern manufacturing and regulatory requirements.
  • Family-Level High‑Speed Capabilities  Stratix 10 GX family innovations include heterogeneous 3D SiP transceiver tiles, support for high-speed transceiver channels, and hard IP such as PCI Express and 10G Ethernet options (family-level features).

Typical Applications

  • High-Speed Networking and Switches  Large logic capacity and substantial on-chip RAM enable complex packet processing, forwarding engines, and interface bridging.
  • Telecommunications Infrastructure  Industrial temperature rating and high I/O count make this device suitable for line cards, backplane interfaces, and protocol offload.
  • Data Center Acceleration  High logic density and family support for high-performance transceivers and PCIe accelerate custom compute and I/O offload tasks.
  • Advanced Embedded Systems  Extensive RAM and I/O resources support sophisticated control, signal processing, and system integration in industrial environments.

Unique Advantages

  • High logic density: 2,800,000 logic elements enable large, complex designs without partitioning across multiple devices.
  • Substantial on-chip RAM: 240,123,904 bits of RAM reduce external memory dependence for buffering and data staging.
  • High I/O integration: 704 I/Os in a single FCBGA package simplify board-level routing and system integration.
  • Industrial robustness: −40°C to 100°C operating range supports deployment in harsh and temperature-variable environments.
  • Power-scalable core supply: 0.770–0.970 V core voltage range provides design flexibility for power-optimized systems.
  • Stratix 10 family innovations: Access to family-level capabilities such as Hyperflex architecture and advanced transceiver/hard-IP options for high-bandwidth designs.

Why Choose 1SG280HU1F50I1VGAS?

The 1SG280HU1F50I1VGAS positions designers to tackle high-performance, high-bandwidth FPGA applications by combining a very large logic fabric with extensive on-chip memory and a high I/O count in a robust industrial package. Its family-level Hyperflex architecture and 14 nm FinFET foundation provide a modern platform for demanding networking, communications, and data-center acceleration tasks.

This device is well suited for engineering teams that require scalable logic capacity, significant embedded RAM, and industrial temperature capability in a single-chip solution. As part of the Stratix 10 GX family, it aligns with designs that leverage advanced transceiver and hard-IP options at the system level.

If you would like pricing or availability, request a quote or submit a purchase inquiry and our team will provide the next steps to obtain 1SG280HU1F50I1VGAS for your project needs.

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