1SG280HU1F50I1VGAS
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2800000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 1,641 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 704 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280HU1F50I1VGAS – Stratix® 10 GX FPGA, 2,800,000 logic elements, 704 I/O, 2397-BBGA (FCBGA)
The 1SG280HU1F50I1VGAS is an Intel Stratix 10 GX field programmable gate array supplied in a 2397-BBGA (FCBGA) package and graded for industrial use. It combines very high logic density with large on-chip RAM and a high I/O count to address demanding, high-bandwidth digital designs.
As part of the Stratix 10 GX family, this device leverages Intel Hyperflex core architecture and advanced 14 nm tri-gate (FinFET) technology to deliver high-performance FPGA fabric suitable for networking, communications, data center, and advanced embedded applications.
Key Features
- Core & Architecture Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology as foundational innovations for the Stratix 10 family.
- Logic Capacity 2,800,000 logic elements for implementing large-scale logic, control, and custom processing pipelines.
- On‑Chip Memory 240,123,904 total RAM bits to support large buffers, packet queues, and intermediate data storage on chip.
- I/O & Package 704 I/O pins in a surface-mount 2397-BBGA (FCBGA) package; supplier device package listed as 2397-FBGA, FC (50×50).
- Power & Supply Core voltage supply range 770 mV to 970 mV to match system power domains and support power-optimized designs.
- Temperature & Grade Industrial grade device rated for operation from −40°C to 100°C.
- Mounting & Compliance Surface-mount package construction and RoHS compliance for modern manufacturing and regulatory requirements.
- Family-Level High‑Speed Capabilities Stratix 10 GX family innovations include heterogeneous 3D SiP transceiver tiles, support for high-speed transceiver channels, and hard IP such as PCI Express and 10G Ethernet options (family-level features).
Typical Applications
- High-Speed Networking and Switches Large logic capacity and substantial on-chip RAM enable complex packet processing, forwarding engines, and interface bridging.
- Telecommunications Infrastructure Industrial temperature rating and high I/O count make this device suitable for line cards, backplane interfaces, and protocol offload.
- Data Center Acceleration High logic density and family support for high-performance transceivers and PCIe accelerate custom compute and I/O offload tasks.
- Advanced Embedded Systems Extensive RAM and I/O resources support sophisticated control, signal processing, and system integration in industrial environments.
Unique Advantages
- High logic density: 2,800,000 logic elements enable large, complex designs without partitioning across multiple devices.
- Substantial on-chip RAM: 240,123,904 bits of RAM reduce external memory dependence for buffering and data staging.
- High I/O integration: 704 I/Os in a single FCBGA package simplify board-level routing and system integration.
- Industrial robustness: −40°C to 100°C operating range supports deployment in harsh and temperature-variable environments.
- Power-scalable core supply: 0.770–0.970 V core voltage range provides design flexibility for power-optimized systems.
- Stratix 10 family innovations: Access to family-level capabilities such as Hyperflex architecture and advanced transceiver/hard-IP options for high-bandwidth designs.
Why Choose 1SG280HU1F50I1VGAS?
The 1SG280HU1F50I1VGAS positions designers to tackle high-performance, high-bandwidth FPGA applications by combining a very large logic fabric with extensive on-chip memory and a high I/O count in a robust industrial package. Its family-level Hyperflex architecture and 14 nm FinFET foundation provide a modern platform for demanding networking, communications, and data-center acceleration tasks.
This device is well suited for engineering teams that require scalable logic capacity, significant embedded RAM, and industrial temperature capability in a single-chip solution. As part of the Stratix 10 GX family, it aligns with designs that leverage advanced transceiver and hard-IP options at the system level.
If you would like pricing or availability, request a quote or submit a purchase inquiry and our team will provide the next steps to obtain 1SG280HU1F50I1VGAS for your project needs.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018