1SG280HU1F50E2VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2800000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 880 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 704 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280HU1F50E2VG – Stratix® 10 GX FPGA, 2,800,000 logic elements, 704 I/O
The 1SG280HU1F50E2VG is an Intel Stratix® 10 GX field programmable gate array optimized for high-bandwidth, compute-intensive applications. Built on the Stratix 10 family architecture, it incorporates core innovations such as the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) process to address demanding networking, communications, and advanced signal-processing designs.
This device delivers a large programmable fabric with 2,800,000 logic elements, abundant on-chip RAM, and a broad I/O complement, making it suitable for designs that require high logic density, extensive memory, and robust I/O connectivity within a 2397-BBGA (FCBGA) package.
Key Features
- Core & Architecture Stratix 10 family innovations including the Intel Hyperflex core architecture and Intel 14 nm tri-gate technology are part of the device family design.
- Logic Capacity 2,800,000 logic elements provide significant programmable logic resources for complex custom algorithms and control logic.
- On-chip Memory 240,123,904 total RAM bits of embedded memory support large buffering, packet processing, and data staging without external memory for many functions.
- I/O and Transceiver Capability 704 I/O pins enable dense external connectivity. The Stratix 10 family also includes heterogeneous transceiver technology with support in the family for high-rate channels and advanced SERDES features.
- Hard IP and DSP Family-level features include hard PCIe Gen3, 10G Ethernet, variable-precision DSP blocks and high-throughput compute resources suitable for signal processing and protocol offload.
- Power and Supply Core voltage supply range: 770 mV to 970 mV, enabling precise power provisioning for the device core.
- Package & Mounting 2397-BBGA, FCBGA package (supplier package: 2397-FBGA, FC, 50 × 50 mm) in a surface-mount form factor for board-level integration.
- Operating Range & Grade Extended grade with an operating temperature range of 0 °C to 100 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- High-bandwidth Networking — Processing, switching, and protocol acceleration in network equipment that requires dense logic, large on-chip memory, and plentiful I/O.
- Data Center and Compute Acceleration — Offload and acceleration of compute kernels, packet processing, and FPGA-based data-plane functions leveraging the device's logic and DSP resources.
- Telecommunications and Optical Systems — High-speed connectivity and transceiver integration for backplane and module-level designs using Stratix 10 family transceiver capabilities.
- Advanced Signal Processing — DSP-heavy workloads such as modulation, filtering, and custom arithmetic implemented across a large programmable fabric and embedded memory.
Unique Advantages
- High Logic Density: 2,800,000 logic elements enable complex designs and multiple concurrent functions on a single device, reducing board count.
- Substantial On-chip Memory: 240,123,904 total RAM bits allow large buffers and local data storage, minimizing external memory dependencies for many workloads.
- Extensive I/O: 704 I/O pins support dense interfacing to peripherals, mezzanine cards, and system interconnects for flexible system integration.
- Family Innovation: Stratix 10 architectural features such as Hyperflex and 14 nm tri-gate technology provide the foundation for higher core performance and energy-efficient implementation across the family.
- Board-level Integration: Surface-mount FCBGA (2397-BBGA) package with a 50 × 50 mm form factor helps simplify mechanical and thermal planning for high-density boards.
- Regulatory & Grade Assurance: RoHS compliance and Extended grade operation provide environmental compliance and a specified temperature envelope for deployment.
Why Choose 1SG280HU1F50E2VG?
The 1SG280HU1F50E2VG positions itself as a high-capacity Stratix 10 GX FPGA option for engineers designing bandwidth- and compute-intensive systems. Its combination of 2.8 million logic elements, large on-chip RAM, and a 704-pin I/O complement supports complex protocol handling, accelerator functions, and extensive system interfacing in a single device.
For teams focused on scalable, high-performance FPGA solutions within the Stratix 10 family, this device offers a balance of logic density, memory resources, and package-level integration that supports demanding networking, compute acceleration, and signal-processing applications while aligning with extended-grade environmental requirements.
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