1SG280HU1F50E2VG

IC FPGA 704 I/O 2397BGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2800000 2397-BBGA, FCBGA

Quantity 880 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O704Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SG280HU1F50E2VG – Stratix® 10 GX FPGA, 2,800,000 logic elements, 704 I/O

The 1SG280HU1F50E2VG is an Intel Stratix® 10 GX field programmable gate array optimized for high-bandwidth, compute-intensive applications. Built on the Stratix 10 family architecture, it incorporates core innovations such as the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) process to address demanding networking, communications, and advanced signal-processing designs.

This device delivers a large programmable fabric with 2,800,000 logic elements, abundant on-chip RAM, and a broad I/O complement, making it suitable for designs that require high logic density, extensive memory, and robust I/O connectivity within a 2397-BBGA (FCBGA) package.

Key Features

  • Core & Architecture Stratix 10 family innovations including the Intel Hyperflex core architecture and Intel 14 nm tri-gate technology are part of the device family design.
  • Logic Capacity 2,800,000 logic elements provide significant programmable logic resources for complex custom algorithms and control logic.
  • On-chip Memory 240,123,904 total RAM bits of embedded memory support large buffering, packet processing, and data staging without external memory for many functions.
  • I/O and Transceiver Capability 704 I/O pins enable dense external connectivity. The Stratix 10 family also includes heterogeneous transceiver technology with support in the family for high-rate channels and advanced SERDES features.
  • Hard IP and DSP Family-level features include hard PCIe Gen3, 10G Ethernet, variable-precision DSP blocks and high-throughput compute resources suitable for signal processing and protocol offload.
  • Power and Supply Core voltage supply range: 770 mV to 970 mV, enabling precise power provisioning for the device core.
  • Package & Mounting 2397-BBGA, FCBGA package (supplier package: 2397-FBGA, FC, 50 × 50 mm) in a surface-mount form factor for board-level integration.
  • Operating Range & Grade Extended grade with an operating temperature range of 0 °C to 100 °C.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • High-bandwidth Networking — Processing, switching, and protocol acceleration in network equipment that requires dense logic, large on-chip memory, and plentiful I/O.
  • Data Center and Compute Acceleration — Offload and acceleration of compute kernels, packet processing, and FPGA-based data-plane functions leveraging the device's logic and DSP resources.
  • Telecommunications and Optical Systems — High-speed connectivity and transceiver integration for backplane and module-level designs using Stratix 10 family transceiver capabilities.
  • Advanced Signal Processing — DSP-heavy workloads such as modulation, filtering, and custom arithmetic implemented across a large programmable fabric and embedded memory.

Unique Advantages

  • High Logic Density: 2,800,000 logic elements enable complex designs and multiple concurrent functions on a single device, reducing board count.
  • Substantial On-chip Memory: 240,123,904 total RAM bits allow large buffers and local data storage, minimizing external memory dependencies for many workloads.
  • Extensive I/O: 704 I/O pins support dense interfacing to peripherals, mezzanine cards, and system interconnects for flexible system integration.
  • Family Innovation: Stratix 10 architectural features such as Hyperflex and 14 nm tri-gate technology provide the foundation for higher core performance and energy-efficient implementation across the family.
  • Board-level Integration: Surface-mount FCBGA (2397-BBGA) package with a 50 × 50 mm form factor helps simplify mechanical and thermal planning for high-density boards.
  • Regulatory & Grade Assurance: RoHS compliance and Extended grade operation provide environmental compliance and a specified temperature envelope for deployment.

Why Choose 1SG280HU1F50E2VG?

The 1SG280HU1F50E2VG positions itself as a high-capacity Stratix 10 GX FPGA option for engineers designing bandwidth- and compute-intensive systems. Its combination of 2.8 million logic elements, large on-chip RAM, and a 704-pin I/O complement supports complex protocol handling, accelerator functions, and extensive system interfacing in a single device.

For teams focused on scalable, high-performance FPGA solutions within the Stratix 10 family, this device offers a balance of logic density, memory resources, and package-level integration that supports demanding networking, compute acceleration, and signal-processing applications while aligning with extended-grade environmental requirements.

Request a quote or submit a quote for 1SG280HU1F50E2VG to check availability, pricing, and lead times for your next design.

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