1SG280HU1F50E1VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2800000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 566 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 704 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280HU1F50E1VG – Stratix® 10 GX FPGA, 2,800,000 logic elements, 704 I/Os, 2397-BBGA
The 1SG280HU1F50E1VG is a Stratix® 10 GX field programmable gate array (FPGA) in a 2397-BBGA (FCBGA) package. It delivers very high logic density and extensive I/O capacity for advanced, bandwidth‑intensive designs.
Designed on the Stratix 10 family architecture, this device benefits from the family-level innovations described in the Stratix 10 GX overview, and is targeted at applications that require large on-chip RAM, substantial logic resources, and broad I/O connectivity while operating in an extended temperature grade.
Key Features
- Logic Capacity 2,800,000 logic elements (cells) provide substantial programmable fabric for complex logic, datapath, and control implementations.
- Configurable Logic Blocks 350,000 ALM/CLB resources (as specified) to implement large-scale digital designs.
- On‑Chip Memory 240,123,904 total RAM bits of embedded memory for buffering, packet processing, and large state storage.
- I/O Density 704 I/Os enable extensive external connectivity for high‑pin‑count systems and wide parallel interfaces.
- Package & Mounting 2397-BBGA (FCBGA) surface-mount package (50×50 mm supplier package noted) suitable for dense board integration.
- Power Supply Range Core supply range from 770 mV to 970 mV to support the device’s operating voltage requirements.
- Operating Temperature Extended grade operation from 0 °C to 100 °C for applications requiring a wider commercial temperature window.
- RoHS Compliance Device is RoHS compliant.
Typical Applications
- High‑performance networking Use the device’s high logic density and large embedded RAM for packet processing, switching, and protocol offload tasks that demand throughput and buffering.
- Data center acceleration Implement custom compute kernels and data-path acceleration where sizable logic resources and on-chip memory reduce latency and footprint.
- Telecommunications infrastructure Deploy in line cards, front‑end processing, and backplane applications that require many I/Os and substantial programmable logic.
- Advanced prototyping and research Suitable for complex FPGA prototypes and experimental systems needing a large fabric and flexible I/O.
Unique Advantages
- High logic density: 2.8M logic elements enable complex, large-scale designs without immediate migration to multi‑chip solutions.
- Large embedded memory: 240,123,904 RAM bits support extensive buffering, lookup tables, and on‑chip data storage to simplify system memory architecture.
- Extensive I/O count: 704 I/Os provide the pin bandwidth needed for wide parallel interfaces and numerous peripheral connections.
- Extended-grade operation: Rated for 0 °C to 100 °C operation to meet broader commercial and telecom deployment requirements.
- Dense BGA integration: 2397-BBGA FCBGA package supports high‑density board layouts while maintaining surface-mount assembly compatibility.
- RoHS compliant: Conforms to RoHS requirements for environmental compliance in board assemblies.
Why Choose 1SG280HU1F50E1VG?
The 1SG280HU1F50E1VG combines very large logic capacity, substantial on‑chip memory, and high I/O density in a single Stratix 10 GX family device. It is positioned for designers who need to implement complex, bandwidth‑oriented FPGA designs within a single, extended‑grade device footprint.
For projects that require scalability and a robust programmable fabric, this FPGA offers a balance of integration and performance-oriented features drawn from the Stratix® 10 GX family, making it suitable for demanding networking, data center, and telecom applications.
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