1SG280HN3F43I3VG

The 1SG280HN3F43I3VG is an Intel Stratix® 10 GX field programmable gate array in a 1760-BBGA (42.5 × 42.5 mm) surface-mount package. Built on the Stratix 10 GX family architecture, it combines the Intel Hyperflex™ core architecture and high-density programmable fabric for bandwidth- and compute-intensive applications.

Targeted at high-performance networking, compute acceleration and advanced signal processing, this device delivers large logic capacity, extensive on-chip RAM and a broad I/O complement while supporting industrial operating temperatures and RoHS compliance.

Key Features

• Core architecture  Intel Hyperflex™ core architecture for increased core performance as described for the Stratix 10 family.
• Logic capacity  2,800,000 logic elements (logic element cells) for implementing large-scale programmable logic designs.
• On-chip memory  240,123,904 total RAM bits, with internal M20K SRAM memory blocks referenced in the Stratix 10 family overview.
• High-speed I/O  688 I/O pins to support wide external interfacing and high-density board-level integration.
• Transceiver and interface capabilities  Stratix 10 family transceiver technology supports multi-gigabit links and hard IP including PCI Express Gen3 and 10G Ethernet features as described in the device overview.
• DSP and compute  Variable-precision DSP block architecture is included in the Stratix 10 family, enabling high-throughput signal processing workloads.
• Power and supply  Nominal core supply range from 770 mV to 970 mV to match system power design requirements.
• Package and mounting  1760-BBGA (FCBGA) supplier device package (1760-FBGA, 42.5 × 42.5 mm), surface-mount.
• Operating range  Industrial temperature grade with an operating range of −40 °C to 100 °C.
• Environmental compliance  RoHS compliant.

Typical Applications

• High-speed networking  Implements packet processing, line-rate forwarding and protocol offloads using the device's large logic capacity and transceiver-enabled interfaces.
• Data center acceleration  Supports hardware acceleration for compute-intensive workloads and custom offload engines leveraging extensive logic elements and DSP resources.
• Advanced signal processing  Enables high-throughput DSP functions and algorithm acceleration using on-chip memory and variable-precision DSP blocks.
• SoC and embedded compute platforms  Integrates complex control and data-path logic where large programmable fabric and hard IP blocks (PCIe/ethernet) are required.

Unique Advantages

• Massive programmable fabric: 2.8 million logic elements provide the capacity to implement complex, high-density designs without immediate partitioning.
• Extensive on-chip memory: 240,123,904 RAM bits enable large buffering, frame memory and on-chip data structures to reduce external memory dependency.
• Wide I/O and system integration: 688 I/O pins and a dense 1760-BBGA package support rich board-level connectivity and high pin-count interfaces.
• Industrial temperature support: Rated for −40 °C to 100 °C operation for deployment in systems that require extended temperature capability.
• Optimized power domain: Core supply range of 770 mV to 970 mV allows designers to plan power delivery and system efficiency around documented device voltages.
• Proven Stratix 10 family technologies: Leverages Hyperflex core architecture, advanced transceiver and hard IP features described in the Stratix 10 overview to address bandwidth- and compute-intensive designs.

Why Choose 1SG280HN3F43I3VG?

The 1SG280HN3F43I3VG positions itself as a high-density, industrial-grade Stratix 10 GX FPGA option for system designers who need large programmable capacity, substantial on-chip RAM and broad I/O in a single FCBGA package. Its family-level architecture and features support demanding networking, acceleration and signal-processing applications.

Designed for scalability and integration, this device is appropriate for engineering teams building high-performance FPGA-based subsystems who require predictable operating ranges, clear supply requirements and compliance credentials for global manufacturing.

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