1SG280HN3F43I1VG

The 1SG280HN3F43I1VG is an Intel Stratix® 10 GX Field Programmable Gate Array in a 1760-BBGA (FCBGA) package. It pairs a high-density programmable fabric with family-level innovations such as the Intel Hyperflex™ core architecture and 14 nm tri-gate (FinFET) technology to address designs that require high processing throughput and advanced I/O capability.

Designed for industrial-grade applications, this device delivers 2,800,000 logic elements, extensive on-chip RAM and a rich I/O set to support bandwidth- and compute-intensive systems where performance, integration and thermal range are key design requirements.

Key Features

• Core Architecture – Based on the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) technology, providing the family-level architectural improvements described for Stratix® 10 GX devices.
• Logic Capacity – 2,800,000 logic elements suited for large-scale FPGA designs and complex logic implementation.
• On-Chip Memory – 240,123,904 total RAM bits for large buffering, packet processing or internal storage of intermediate data.
• I/O and Transceivers – 688 user I/O pins and family-level support for high-speed transceivers; the Stratix® 10 family includes heterogeneous transceiver tiles and transceiver data rates up to 28.3 Gbps (family-level capability).
• Interfaces & Hard IP (Family-Level) – Stratix® 10 GX family documentation highlights hard IP such as PCI Express® Gen3 x16, 10G Ethernet with FEC and high-performance memory controllers for DDR4 (family-level features referenced in the device overview).
• Package & Mounting – 1760-BBGA FCBGA package (supplier device package: 1760-FBGA, 42.5 × 42.5 mm); surface-mount design for compact board integration.
• Power Supply – Core voltage supply range from 770 mV to 970 mV to match system power-rail planning.
• Operating Temperature – Industrial temperature grade with an operating range of −40 °C to 100 °C for deployment in demanding thermal environments.
• Environmental Compliance – RoHS compliant.

Typical Applications

• High‑Performance Networking – Use the device’s high logic density, large on‑chip RAM and high‑speed transceiver family capabilities for packet processing, switch/ router engines and backplane interfaces.
• Data Center & Acceleration – Leverage the large logic and memory resources for hardware acceleration tasks, custom compute pipelines and PCIe-based accelerator cards (family-level PCIe hard IP available).
• Telecommunications – Implement multi-channel transceiver designs, forward error correction and high-throughput signal processing supported by the Stratix® 10 GX architecture.
• Industrial Systems – Industrial-grade temperature rating and surface-mount 1760-BBGA packaging make this FPGA suitable for demanding control, inspection and processing systems requiring long-term reliability.

Unique Advantages

• High Logic Density: 2.8 million logic elements allow complex algorithms and wide datapaths to be implemented on a single device, reducing board count.
• Massive On-Chip RAM: Over 240 million bits of internal RAM provide large local buffering to minimize external memory bandwidth needs.
• Robust I/O Count: 688 I/O pins give flexibility for multi-protocol interfaces, parallel buses and dense connector implementations.
• Industrial Temperature Range: −40 °C to 100 °C operating range supports deployment in harsh and thermally variable environments.
• Family-Level High-Speed Capabilities: Stratix® 10 GX family features such as Hyperflex architecture and high-speed transceivers (family-level up to 28.3 Gbps) deliver the performance building blocks for high-bandwidth system designs.
• Compact, High-Pin Package: 1760-BBGA FCBGA with 42.5 × 42.5 mm supplier footprint enables dense integration while preserving signal routing options.

Why Choose 1SG280HN3F43I1VG?

The 1SG280HN3F43I1VG combines a high-density Stratix® 10 GX FPGA fabric with substantial on-chip memory and extensive I/O in a 1760-BBGA package, offering a platform suited to demanding compute and bandwidth requirements. Its industrial temperature rating and RoHS compliance make it appropriate for long-life, production-grade systems.

This device is well suited to engineering teams building high-performance networking, data‑center acceleration, telecommunications and industrial processing systems that require a scalable, high-capacity FPGA with family-proven architectural features and high-speed interface capabilities.

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