1SG280HN3F43I1VGAS

The 1SG280HN3F43I1VGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) delivered in a 1760‑FBGA package (42.5 × 42.5 mm) for surface‑mount applications. Built on the Stratix 10 family architecture, it leverages the Intel Hyperflex™ core architecture and Intel 14 nm tri‑gate process to address high‑performance, high‑bandwidth applications.

With an array of programmable logic, large on‑chip RAM, and extensive I/O, this device is targeted at demanding networking, communications, and compute acceleration applications where high logic capacity, dense I/O, and controlled power/thermal operation are required.

Key Features

• Core & Architecture  Intel Stratix 10 family Hyperflex™ core architecture and 14 nm tri‑gate (FinFET) process designed for higher core performance and improved power efficiency compared to prior generations.
• Logic Capacity  Approximately 2,800,000 logic elements and 350,000 CLBs provide substantial programmable fabric for complex designs.
• On‑chip Memory  Total on‑device RAM of 240,123,904 bits for large buffering, packet processing, and intermediate storage requirements.
• I/O Density  688 user I/O pins suitable for systems requiring wide parallel interfaces and dense board connectivity.
• Transceiver & High‑speed I/O (family features)  Stratix 10 family transceiver technology supports high data‑rate links and advanced PHY features to serve demanding serial communications and backplane applications.
• Interfaces & Hard IP (family features)  Device family includes hard IP options such as PCI Express and 10G/40G Ethernet primitives for common interface needs.
• Package & Mounting  1760‑FBGA (42.5 × 42.5 mm) FCBGA package designed for surface‑mount assembly in compact board layouts.
• Power Supply  Core supply range of 770 mV to 970 mV to match system power rails and enable controlled core voltage operation.
• Operating Temperature  Industrial operating range from −40°C to 100°C for deployment in a wide range of environments.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing requirements.

Typical Applications

• High‑speed Networking  Logic density, large on‑chip RAM, and family transceiver capabilities enable packet processing, switching, and line‑rate traffic management.
• Data Center Acceleration  Large logic capacity and memory support hardware acceleration for compute‑intensive workloads and custom offload engines.
• Telecommunications & Backplanes  High I/O count and Stratix 10 transceiver features make the device suitable for backplane interfacing and multi‑lane serial links.
• Test & Measurement Systems  Deterministic FPGA fabric and abundant I/O allow implementation of real‑time signal processing and protocol analysis functions.

Unique Advantages

• Substantial Logic Resources:  2,800,000 logic elements provide headroom for large, multi‑function designs without partitioning across multiple devices.
• Large On‑chip Memory:  240,123,904 bits of RAM reduce external memory dependence for buffering and high‑throughput data paths.
• High I/O Density:  688 I/O pins support complex board-level interconnects, multi‑lane interfaces, and dense peripheral attachments.
• Industrial Temperature Range:  Rated for −40°C to 100°C operation to support deployment in industrial and rugged environments.
• Compact, High‑Pin Package:  1760‑FBGA (42.5 × 42.5 mm) package balances integration density and board footprint for space‑constrained systems.
• Compliance and Manufacturability:  Surface‑mount package and RoHS compliance simplify modern assembly flows and regulatory requirements.

Why Choose 1SG280HN3F43I1VGAS?

The 1SG280HN3F43I1VGAS combines the Stratix 10 family’s Hyperflex architecture and advanced 14 nm process characteristics with high logic capacity, extensive on‑chip RAM, and dense I/O to deliver a platform suitable for demanding, high‑bandwidth FPGA applications. Its industrial temperature rating and RoHS compliance make it appropriate for deployments that require robustness and regulatory adherence.

This device is ideal for engineers designing large, integrated FPGA systems for networking, data center acceleration, telecommunications, and precision instrumentation who need a high‑capacity, high‑I/O FPGA with controlled power and package options that fit modern surface‑mount production.

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